LTC4446
6
4446f
PIN FUNCTIONS
BLOCK DIAGRAM
TINP (Pin 1): High Side Input Signal. Input referenced
to GND. This input controls the high side driver output
(TG).
BINP (Pin 2): Low Side Input Signal. This input controls
the low side driver output (BG).
V
CC
(Pin 3): Supply. This pin powers input buffers, logic
and the low side gate driver output directly and the high
side gate driver output through an external diode con-
nected between this pin and BOOST (Pin 6). A low ESR
ceramic bypass capacitor should be tied between this pin
and GND (Pin 9).
BG (Pin 4): Low Side Gate Driver Output (Bottom Gate).
This pin swings between V
CC
and GND.
NC (Pin 5): No Connect. No connection required.
BOOST (Pin 6): High Side Bootstrapped Supply. An ex-
ternal capacitor should be tied between this pin and TS
(Pin 8). Normally, a bootstrap diode is connected between
V
CC
(Pin 3) and this pin. Voltage swing at this pin is from
V
CC
– V
D
to V
IN
+ V
CC
– V
D
, where V
D
is the forward volt-
age drop of the bootstrap diode.
TG (Pin 7): High Side Gate Driver Output (Top Gate). This
pin swings between TS and BOOST.
TS (Pin 8): High Side MOSFET Source Connection (Top
Source).
Exposed Pad (Pin 9): Ground. Must be soldered to PCB
ground for optimal thermal performance.
TIMING DIAGRAM
3
6
7
9
HIGH SIDE
LEVEL SHIFTER
V
CC
UVLO
LDO V
INT
V
CC
GND
7.2V TO
13.5V
BOOST
V
IN
UP TO 100V
TG
8
TS
BG
4446 BD
1
TINP
BINP
2
5
NC
LOW SIDE
LEVEL SHIFTER
V
CC
V
CC
4
90%
INPUT RISE/FALL TIME < 10ns
TINP (BINP)
BG (TG)
BINP (TINP)
TG (BG)
90% 90%
t
r
t
f
t
PHL
t
PLH
10%
4444 TD
10%
10%