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AT24C512N-10SI-2.7

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P20
13
AT24C512
1116K–SEEPR–1/04
Note: For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC characteristics tables.
Ordering Information
Ordering Code Package Operation Range
AT24C512C1-10CI-2.7
AT24C512-10PI-2.7
AT24C512W-10SI-2.7
AT24C512N-10SI-2.7
AT24C512-10TI-2.7
AT24C512-10UI-2.7
8CN1
8P3
8S2
8S1
8A2
8U2
Industrial Temperature
(-40° C to 85° C)
AT24C512C1-10CI-1.8
AT24C512-10PI-1.8
AT24C512W-10SI-1.8
AT24C512N-10SI-1.8
AT24C512-10TI-1.8
AT24C512-10UI-1.8
8CN1
8P3
8S2
8S1
8A2
8U2
Industrial Temperature
(-40° C to 85° C)
AT24C512N-10SU-2.7
AT24C512N-10SU-1.8
AT24C512-10TU-2.7
AT24C512-10TU-1.8
8S1
8S1
8A2
8A2
Lead-free/Halogen-free/
Industrial Temperature
(-40° C to 85° C)
Package Type
8CN1 8-lead, 0.300" Wide, Leadless Array Package (LAP)
8P3 8-lead, 0.300" Wide, Plastic Dual In-line Package (PDIP)
8S2 8-lead, 0.200” Wide, Plastic Gull Wing Small Outline Package (EIAJ SOIC)
8S1 8-lead, 0.150” Wide, Plastic Gull Wing Small Outline Package (JEDEC SOIC)
8A2 8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)
8U2 8-ball, die Ball Grid Array Package (dBGA)
Options
-2.7 Low-voltage (2.7V to 5.5V)
-1.8 Low-voltage (1.8V to 3.6V)
14
AT24C512
1116K–SEEPR–1/04
Packaging Information
8CN1 – LAP
2325 Orchard Parkway
San Jose, CA 95131
TITLE
DRAWING NO.
R
REV.
8CN1, 8-lead (8 x 5 x 1.04 mm Body), Lead Pitch 1.27 mm,
Leadless Array Package (LAP)
A
8CN1
11/13/01
Pin1 Corner
Marked Pin1 Indentifier
0.10 mm
TYP
4
3
2
1
5
6
7
8
Top View
L
b
e
L1
e1
Side View
A1
A
Bottom View
E
D
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
A 0.94 1.04 1.14
A1 0.30 0.34 0.38
b 0.36 0.41 0.46 1
D 7.90 8.00 8.10
E 4.90 5.00 5.10
e 1.27 BSC
e1 0.60 REF
L 0.62 0.67 0.72 1
L1 0.92 0.97 1.02 1
Note: 1. Metal Pad Dimensions.
15
AT24C512
1116K–SEEPR–1/04
8P3 – PDIP
2325 Orchard Parkway
San Jose, CA 95131
TITLE
DRAWING NO.
R
REV.
8P3, 8-lead, 0.300" Wide Body, Plastic Dual
In-line Package (PDIP)
01/09/02
8P3
B
D
D1
E
E1
e
L
b2
b
A2 A
1
N
eA
c
b3
4 PLCS
Top View
Side View
End View
COMMON DIMENSIONS
(Unit of Measure = inches)
SYMBOL
MIN
NOM
MAX
NOTE
Notes: 1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA for additional information.
2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3.
3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch.
4. E and eA measured with the leads constrained to be perpendicular to datum.
5. Pointed or rounded lead tips are preferred to ease insertion.
6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm).
A 0.210 2
A2 0.115 0.130 0.195
b 0.014 0.018 0.022 5
b2 0.045 0.060 0.070 6
b3 0.030 0.039 0.045 6
c 0.008 0.010 0.014
D 0.355 0.365 0.400 3
D1 0.005 3
E 0.300 0.310 0.325 4
E1 0.240 0.250 0.280 3
e 0.100 BSC
eA 0.300 BSC 4
L 0.115 0.130 0.150 2
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P20

AT24C512N-10SI-2.7

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Buy AT24C512N-10SI-2.7
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Description:
IC EEPROM 512K I2C 1MHZ 8SOIC
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