ADG633 Data Sheet
Rev. B | Page 14 of 16
OUTLINE DIMENSIONS
16
9
8
1
PIN 1
SEATING
PLANE
8°
0°
4.50
4.40
4.30
6.40
BSC
5.10
5.00
4.90
0.65
BSC
0.15
0.05
1.20
MAX
0.20
0.09
0.75
0.60
0.45
0.30
0.19
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 31. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
4.10
4.00 SQ
3.90
0.35
0.30
0.25
2.25
2.10 SQ
1.95
1
0.65
BSC
BOTTOM VIEWTOP VIEW
16
5
8
9
12
13
4
0.70
0.60
0.50
SEATING
PLANE
0.05 MAX
0.02 NOM
0.203 REF
0.25 MIN
COPLANARITY
0.08
PIN 1
INDICATOR
0.80
0.75
0.70
COMPLIANT
TO
JEDEC STANDARDS MO-220-WGGC.
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
04-15-2016-A
PKG-004025/5112
PIN 1
INDIC ATOR AREA OPTIONS
(SEE DETAIL A)
DETAIL A
(JEDEC 95)
EXPOSED
PAD
Figure 32. 16-Lead Frame Chip Scale Package [LFCSP]
4 mm × 4 mm Body and 0.75 mm Package Height
(CP-16-23)
Dimensions shown in millimeters
ORDERING GUIDE
Model
Temperature Range Package Description Package Option
16-Lead Thin Shrink Small Outline Package [TSSOP]
ADG633YRU-REEL7 −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG633YRUZ −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG633YRUZ-REEL7 −40°C to +125°C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16
ADG633YCPZ −40°C to +85°C 16-Lead Lead Frame Chip Scale Package [LFCSP] CP-16-23
ADG633YCPZ-REEL7 −40°C to +85°C 16-Lead Lead Frame Chip Scale Package [LFCSP] CP-16-23
1
Z = RoHS Compliant Part.