© March 2010 Altera Corporation Stratix III Device Handbook, Volume 1
1. Stratix III Device Family Overview
The Stratix
®
III family provides one of the most architecturally advanced,
high-performance, low-power FPGAs in the marketplace.
Stratix III FPGAs lower power consumption through Altera’s innovative
Programmable Power Technology, which provides the ability to turn on the
performance where needed and turn down the power consumption for blocks not in
use. Selectable Core Voltage and the latest in silicon process optimizations are also
employed to deliver the industry’s lowest power, high-performance FPGAs.
Specifically designed for ease of use and rapid system integration, the Stratix III
FPGA family offers two variants optimized to meet different application needs:
■ The Stratix III L family provides balanced logic, memory, and multiplier ratios for
mainstream applications.
■ The Stratix III E family is memory- and multiplier-rich for data-centric
applications.
Modular I/O banks with a common bank structure for vertical migration lend
efficiency and flexibility to the high-speed I/O. Package and die enhancements with
dynamic on-chip termination, output delay, and current strength control provide
best-in-class signal integrity.
Based on a 1.1-V, 65-nm all-layer copper SRAM process, the Stratix III family is a
programmable alternative to custom ASICs and programmable processors for
high-performance logic, digital signal processing (DSP), and embedded designs.
Stratix III devices include optional configuration bit stream security through volatile
or non-volatile 256-bit Advanced Encryption Standard (AES) encryption. Where
ultra-high reliability is required, Stratix III devices include automatic error detection
circuitry to detect data corruption by soft errors in the configuration random-access
memory (CRAM) and user memory cells.
Features Summary
Stratix III devices offer the following features:
■ 48,000 to 338,000 equivalent logic elements (LEs) ( refer to Ta ble 1–1 )
■ 2,430 to 20,497 Kbits of enhanced TriMatrix memory consisting of three RAM
block sizes to implement true dual-port memory and FIFO buffers
■ High-speed DSP blocks provide dedicated implementation of 9×9, 12×12, 18×18,
and 36×36 multipliers (at up to 550 MHz), multiply-accumulate functions, and
finite impulse response (FIR) filters
■ I/O:GND:PWR ratio of 8:1:1 along with on-die and on-package decoupling for
robust signal integrity
■ Programmable Power Technology, which minimizes power while maximizing
device performance
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