ADA4805-2-EP Enhanced Product
Rev. 0 | Page 6 of 9
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter Rating
Supply Voltage 11 V
Common-Mode Input Voltage −V
S
− 0.7 V to +V
S
+ 0.7 V
Differential Input Voltage ±1 V
Storage Temperature Range −65°C to +125°C
Operating Temperature Range −55°C to +125°C
Lead Temperature (Soldering, 10 sec) 300°C
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst case conditions, that is, θ
JA
is specified
for a device soldered in a circuit board for surface-mount packages.
Table 6 lists the θ
JA
for the ADA4805-2-EP.
Table 6. Thermal Resistance
Package Type θ
JA
Unit
8-Lead MSOP 123.8 °C/W
MAXIMUM POWER DISSIPATION
The maximum safe power dissipation for the ADA4805-2-EP is
limited by the associated rise in junction temperature (T
J
) on
the die. At approximately 150°C, which is the glass transition
temperature, the properties of the plastic change. Even temporarily
exceeding this temperature limit may change the stresses that the
package exerts on the die, permanently shifting the parametric
performance of the ADA4805-2-EP. Exceeding a junction tempera-
ture of 175°C for an extended period of time can result in changes
in silicon devices, potentially causing degradation or loss of
functionality.
The power dissipated in the package (P
D
) is the sum of the
quiescent power dissipation and the power dissipated in the die
due to the ADA4805-2-EP output load drive.
The quiescent power dissipation is the voltage between the supply
pins (V
S
) multiplied by the quiescent current (I
S
).
P
D
= Quiescent Power + (Total Drive Power − Load Power)
(
)
L
OUT
L
OUTS
S
S
D
R
V
R
V
V
I
V
P
2
2
−
×
+
×
=
RMS output voltages must be considered. If R
L
is referenced
to −V
S
, as in single-supply operation, the total drive power is
V
S
× I
OUT
. If the rms signal levels are indeterminate, consider the
worst case, when V
OUT
= V
S
/4 for R
L
to midsupply.
( )
( )
L
S
SSD
R
V
IVP
2
4/
+×=
In single-supply operation with R
L
referenced to −V
S
, worst case
is V
OUT
= V
S
/2.
Airflow increases heat dissipation, effectively reducing θ
JA
. Also,
more metal directly in contact with the package leads and exposed
pad from metal traces, through holes, ground, and power planes
reduces θ
JA
.
Figure 3 shows the maximum safe power dissipation in the
package vs. the ambient temperature on a JEDEC standard,
4-layer board. θ
JA
values are approximations.
MAXIMUM POWER DISSIPATION (W)
13741-011
AMBIENT TEMPERATURE (°C)
0
0.4
0.8
1.2
1.6
2.0
–55
–35
–15
5
25 45 65
85
105 125
8-LEAD MSOP
T
J
= 150°C
Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
ESD CAUTION
