ulTIMiFlux Dielectric Phase Change Thermal Material
CD-02-05
www.wakefield-vette.com
Wakefield-Vette's ulTIMiFlux line of thermal interface materials offer high performance, low cost,
configurability and custom sizes for your thermal system needs. Thermal Interface Materials (TIM) are
a secondary material installed between the heat sink and the device which are designed to improve the
thermal transfer to the heat sink. Regardless of how flat or smooth the device and heat sink are, there
will always be small air voids between the two surfaces. Since air is a not a great conductor of heat, a
TIM replaces the air and fills the voids. There are many types of TIMs and each has its best case
usages. Wakefield-Vetts’s line of dielectric phase change thermal materials are intended to fill voids
between a device and the heat sink and utilizes a polyimide film to act as a thermally conductive carrier
in order to deliver a uniform thickness coating of phase-change thermal compound on both sides.
60
o
C/140
o
F PHASE-CHANGE TEMPERATURE
FEATURES AND BENIFITS
● Low Thermal Impedance
● Excellent Replacement for Thermal Greases
● Thixotropic / Prevents Compound Run-Out
● Excellent Mechanical & Dielectric Properties
● Cost Effective “Drop in Place” Solution
● RoHS and Halogen Free Compliant
Phase Change Compound
Phase Change Compound
Polyimide Substrate Carrier
Standard Phase Change Pad Construction
Through the development of this unique formulation,
Wakefield-Vette’s phase change solution offers
efficient thermal transfer by phase-changing during
normal device operating temperatures while
maintaining a uniform bond line thus driving out the
air and adjusting for any surface imperfections or
flatness conditions that may exist across the interface.
This construction is useful in a wide range of
electronic cooling applications from transistors,
diodes or any type of heat generating non-isolated
power device.
A primary advantage of utilizing a phase-
change system is the ability to drive out air
from within the interface during initial device
cycling causing phase change and surface
wetting of the thermal compound coating.
The phase-change compound is available in
specific die cut patterns for common TO
packages and can be placed instantly and
immediately ready for component mounting.
Due to it’s thixotropic formulation design,
compound is held within the interface with no
worries of run-out into unwanted areas during
normal device/component operation.
