SMA6TY Characteristics
Doc ID 17869 Rev 3 7/11
Figure 10. Junction capacitance versus reverse
applied voltage for unidirectional
types (typical values)
Figure 11. Junction capacitance versus
reverse applied voltage for
bidirectional types (typical values)
C(pF)
10
100
1000
10000
1 10 100 1000
F=1 MHz
V
OSC
=30 mV
RMS
T
j
=25 °C
SMA6T6V7AY
SMA6T30AY
SMA6T82AY
V (V)
R
C(pF)
10
100
1000
10000
1 10 100 1000
F=1 MHz
V
OSC
=30 mV
RMS
T
j
=25 °C
SMA6T6V7CAY
SMA6T30CAY
SMA6T82CAY
V (V)
R
Figure 12. Relative variation of thermal
impedance, junction to ambient,
versus pulse duration
Figure 13. Thermal resistance junction to
ambient versus copper surface
under each lead
Zth (j-a)/Rth (j-a)
0.01
0.10
1.00
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
s
t
p
Printed circuit board FR4,
copper surface = 1 cm
2
R
th(j-a)
(°C/W)
40
50
60
70
80
90
100
110
120
130
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
printed circuit board FR4,
copper thickness = 35 µm
S
Cu
(cm²)
Figure 14. Leakage current versus junction
temperature (typical values)
Figure 15. Peak forward voltage drop versus
peak forward current
(typical values)
I (nA)
R
1.E+00
1.E+01
1.E+02
1.E+03
1.E+04
25 50 75 100 125 150
V
R
=V
RM
V
RM
> 10 V
V
RM
≤ 10 V
T (°C)
j
I
FM
(A)
1.E-02
1.E-01
1.E+00
1.E+01
0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4
T
j
=25 °C
T
j
=125 °C
V
FM
(V)
