IRF7748L1TRPBF

1
www.irf.com © 2012 International Rectifier February 18, 2013
Base part number Package Type Standard Pack Orderable Part Number
Form Quantity
IRF7748L1TRPbF DirectFET Large Can Tape and Reel 4000 IRF7748L1TRPbF
Applications
RoHS Compliant, Halogen Free
Lead-Free (Qualified up to 260°C Reflow)
Ideal for High Performance Isolated Converter
Primary Switch Socket
Optimized for Synchronous Rectification
Low Conduction Losses
High Cdv/dt Immunity
Low Profile (<0.7mm)
Dual Sided Cooling Compatible
Compatible with existing Surface Mount Techniques
Industrial Qualified
DirectFET™ Power MOSFET
Fig 1. Typical On-Resistance vs. Gate Voltage
DirectFET ISOMETRIC
L6
Ordering Information
V
DSS
V
GS
R
DS(on)
60V min
±20V max
1.7m@ 10V
Q
g tot
Q
gd
V
gs(th)
146nC 40nC 2.9V
D D
G
S
SS
SSS
Applicable DirectFET Outline and Substrate Outline
SB SC M2 M4 L4 L6 L8
Description
The IRF7748L1TRPbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packag-
ing to achieve the lowest on-state resistance in a package that has a footprint smaller than a D2PAK and only 0.7 mm profile. The
DirectFET package is compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor
phase, infra-red or convection soldering techniques, when application note AN-1035 is followed regarding the manufacturing methods
and processes. The DirectFET package allows dual sided cooling to maximize thermal transfer in power systems.
The IRF7748L1TRPbF is optimized for high frequency switching and synchronous rectification applications. The reduced total losses
in the device coupled with the high level of thermal performance enables high efficiency and low temperatures, which are key for sys-
tem reliability improvements, and makes this device ideal for high performance power converters.
Absolute Maximum Ratings
Parameter Max. Units
V
DS
Drain-to-Source Voltage 60
V V
GS
Gate-to-Source Voltage ±20
I
D
@ T
C
= 25°C Continuous Drain Current, V
GS
@ 10V (Silicon Limited) 148
I
D
@ T
C
= 100°C Continuous Drain Current, V
GS
@ 10V (Silicon Limited) 104
I
D
@ T
A
= 25°C Continuous Drain Current, V
GS
@ 10V (Silicon Limited) 28
A
I
DM
Pulsed Drain Current 592
E
AS
Single Pulse Avalanche Energy 129 mJ
I
AR
Avalanche Current 89 A
Notes
Click on this section to link to the appropriate technical paper.
Click on this section to link to the DirectFET Website.
Surface mounted on 1 in. square Cu board, steady state.
TC measured with thermocouple mounted to top (Drain) of part.
Repetitive rating; pulse width limited by max. junction temperature.
Starting T
J
= 25°C, L = 0.033mH, R
G
= 50, I
AS
= 89A.
0 25 50 75 100 125 150 175 200
I
D
, Drain Current (A)
1.0
1.5
2.0
2.5
3.0
T
y
p
i
c
a
l
R
D
S
(
o
n
)
(
m
V
GS
= 7V
V
GS
= 6V
V
GS
= 10V
V
GS
= 12V
Fig 2. Typical On-Resistance vs. Drain Current
2 4 6 8 10 12 14 16 18 20
V
GS,
Gate -to -Source Voltage (V)
0
2
4
6
8
R
D
S
(
o
n
)
,
D
r
a
i
n
-
t
o
-
S
o
u
r
c
e
O
n
R
e
s
i
s
t
a
n
c
e
(
m
)
I
D
= 89A
T
J
= 25°C
T
J
= 125°C
IRF7748L1TRPbF
Typical values (unless otherwise specified)
2
www.irf.com © 2012 International Rectifier February 18, 2013
IRF7748L1TRPbF
Static @ T
J
= 25°C (unless otherwise specified)
Parameter Min. Typ. Max. Units Conditions
BV
DSS
Drain-to-Source Breakdown Voltage 60 ––– ––– V V
GS
= 0V, I
D
= 250µA
V
DSS
/T
J
Breakdown Voltage Temp. Coefficient ––– 0.022 ––– V/°C Reference to 25°C, I
D
= 2mA
R
DS(on)
Static Drain-to-Source On-Resistance ––– 1.7 2.2
m
V
GS
= 10V, I
D
= 89A 
V
GS(th)
Gate Threshold Voltage 2.0 2.9 4.0 V
V
DS
= V
GS
, I
D
= 250µA
I
DSS
Drain-to-Source Leakage Current
––– ––– 20
µA
V
DS
=60 V, V
GS
= 0V
––– ––– 250 V
DS
=60V,V
GS
= 0V,T
J
=125°C
I
GSS
Gate-to-Source Forward Leakage ––– ––– 100
nA
V
GS
= 20V
Gate-to-Source Reverse Leakage ––– ––– -100 V
GS
= -20V
gfs Forward Transconductance 176 ––– ––– S V
DS
= 10V, I
D
=89A
Q
g
Total Gate Charge ––– 146 220
Q
gs1
Pre– Vth Gate-to-Source Charge ––– 31 –––
V
DS
= 30V
Q
gs2
Post– Vth Gate-to-Source Charge ––– 12 ––– nC V
GS
= 10V
Q
gd
Gate-to-Drain Charge ––– 40 –––
I
D
= 89A
Q
godr
Gate Charge Overdrive ––– 63 –––
See Fig.9
Q
sw
Switch Charge (Q
gs2 +
Q
gd)
––– 52 –––
Q
oss
Output Charge ––– 82 ––– nC V
DS
= 16V,V
GS
= 0V
R
G
Gate Resistance ––– 1.3 –––

t
d(on)
Turn-On Delay Time ––– 19 –––
ns
V
DD
= 30V, V
GS
= 10V
t
r
Rise Time ––– 104 ––– I
D
= 89A
t
d(off)
Turn-Off Delay Time ––– 54 –––
R
G
= 1.8
t
f
Fall Time ––– 77 –––
C
iss
Input Capacitance ––– 8075 –––
pF
V
GS
= 0V
C
oss
Output Capacitance ––– 1150 ––– V
DS
= 50V
C
rss
Reverse Transfer Capacitance ––– 540 –––
ƒ = 1.0MHz
C
oss
Output Capacitance ––– 5390 ––– V
GS
=0V, V
DS
= 1.0V,ƒ =1.0MHz
C
oss
Output Capacitance ––– 850 ––– V
GS
=0V, V
DS
= 48V,ƒ =1.0MHz
Diode Characteristics
Parameter Min. Typ. Max. Units Conditions
I
S
Continuous Source Current
––– ––– 85
A
MOSFET symbol
(Body Diode)
showing the
I
SM
Pulsed Source Current
––– ––– 592
integral reverse
(Body Diode) p-n junction diode.
V
SD
Diode Forward Voltage ––– ––– 1.3 V T
J
= 25°C,I
S
= 89A,V
GS
= 0V 
t
rr
Reverse Recovery Time
––– 58 –––
ns T
J
= 25°C ,I
F
= 89A,V
DD
= 30V
Q
rr
Reverse Recovery Charge
––– 113 –––
nC di/dt = 100A/µs 
V
GS(th)
/T
J
Gate Threshold Voltage Temp. Coefficient ––– -9.9 ––– mV/°C
Notes:
Repetitive rating; pulse width limited by max. junction temperature.
Pulse width 400µs; duty cycle 2%
3
www.irf.com © 2012 International Rectifier February 18, 2013
IRF7748L1TRPbF
Notes:
Surface mounted on 1 in. square Cu board, steady state.
T
C
measured with thermocouple incontact with top (Drain) of part.
Repetitive rating; pulse width limited by max. junction temperature.
Absolute Maximum Ratings

Symbol Parameter Max. Units
P
D
@T
C
= 25°C Power Dissipation
94
P
D
@T
C
= 100°C Power Dissipation
47
W
P
D
@T
A
= 25°C
Power Dissipation 3.3
T
P
Peak Soldering Temperature 270
T
J
Operating Junction and -55 to + 175
°C
T
STG
Storage Temperature Range
Thermal Resistance

Symbol Parameter Typ. Max. Units
R
qJA
Junction-to-Ambient  ––– 45
R
qJA
Junction-to-Ambient  12.5 –––
R
qJA
Junction-to-Ambient  20 ––– °C/W
R
qJC
Junction-to-Can 
–––
1.6
R
qJA-PCB
Junction-to-PCB Mounted
–––
0.5
Used double sided cooling, mounting pad with large heatsink.
Mounted on minimum footprint full size board with metalized
back and with small clip heatsink.
R
is measured at T
J
of approximately 90°C.
Surface mounted on 1 in. square Cu
board (still air).
Mounted on minimum footprint full size board with metalized
back and with small clip heatsink (still air)
Fig3.MaximumEecveTransientThermalImpedance,JuncontoCase
1E-006 1E-005 0.0001 0.001 0.01 0.1 1
t
1
, Rectangular Pulse Duration (sec)
0.001
0.01
0.1
1
10
T
h
e
r
ma
l
R
e
s
p
o
n
s
e
(
Z
t
h
J
C
)
°
C
/
W
0.20
0.10
D = 0.50
0.02
0.01
0.05
SINGLE PULSE
( THERMAL RESPONSE )
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthjc + Tc

IRF7748L1TRPBF

Mfr. #:
Manufacturer:
Infineon Technologies
Description:
MOSFET 60V N-Ch 139A 2.15 mOhm 147nC
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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