MM74HC174M

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MM74HC174
AC Electrical Characteristics
V
CC
= 5V, T
A
= 25°C, C
L
= 15pF, t
r
= t
f
= 6 ns
AC Electrical Characteristics
C
L
= 50 pF, t
r
= t
f
= 6 ns (unless otherwise specified)
Note 5: C
PD
determines the no load dynamic power consumption, P
D
= C
PD
V
CC
2
f + I
CC
V
CC
, and the no load dynamic current consumption,
I
S
= C
PD
V
CC
f + I
CC
.
Symbol Parameter Conditions Typ
Guaranteed
Units
Limit
f
MAX
Maximum Operating 50 30 MHz
Frequency
t
PHL
, t
PLH
Maximum Propagation 16 30 ns
Delay, Clock or Clear to Output
t
REM
Minimum Removal Time, 25ns
Clear to Clock
t
S
Minimum Setup Time 10 20 ns
Data to Clock
t
H
Minimum Hold Time 0 5 ns
Clock to Data
t
W
Minimum Pulse Width 10 16 ns
Clock or Clear
Symbol Parameter Conditions
V
CC
T
A
= 25°CT
A
= 40 to 85°CT
A
= 55 to 125°C
Units
Typ Guaranteed Limits
f
MAX
Maximum Operating 2.0V 5 4 3 MHz
Frequency 4.5V 27 21 18 MHz
6.0V 31 24 20 MHz
t
PHL
, t
PLH
Maximum Propagation 2.0V 55 165 206 248 ns
Delay Clock or Clear to Output 4.5V 18 33 41 49 ns
6.0V 16 28 35 42 ns
t
REM
Minimum Removal Time 2.0V 1 5 5 5 ns
Clear to Clock 4.5V 1 5 5 5 ns
6.0V 1 5 5 5 ns
t
S
Minimum Setup Time 2.0V 42 100 125 150 ns
Data to Clock 4.5V 12 20 25 30 ns
6.0V 10 17 21 25 ns
t
H
Minimum Hold Time 2.0V 1 5 5 5 ns
Clock to Data 4.5V 1 5 5 5 ns
6.0V 1 5 5 5 ns
t
W
Minimum Pulse Width 2.0V 35 80 106 120 ns
Clock or Clear 4.5V 10 16 20 24 ns
6.0V 8 14 18 20 ns
t
TLH
, t
THL
Maximum Output Rise 2.0V 30 75 95 110 ns
and Fall Time 4.5V 8 15 19 22 ns
6.0V 7 13 16 19 ns
t
r
, t
f
Maximum Input Rise and 2.0V 1000 1000 1000 ns
Fall Time 4.5V 500 500 500 ns
6.0V 400 400 400 ns
C
PD
Power Dissipation (per package) 136 pF
Capacitance (Note 5)
C
IN
Maximum Input 5 10 10 10 pF
Capacitance
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MM74HC174
Physical Dimensions inches (millimeters) unless otherwise noted
16-Lead Small Outline Integrated Circuit (SOIC)JEDEC MS-012, 0.150” Narrow
Package Number M16A
16-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
Package Number M16D
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MM74HC174
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
16-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package Number MTC16

MM74HC174M

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
IC FF D-TYPE SNGL 6BIT 16SOIC
Lifecycle:
New from this manufacturer.
Delivery:
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