SS22T3G, SS24T3G, NRVBSS24T3G, SBRSS24T3G
www.onsemi.com
5
PACKAGE DIMENSIONS
SMB
CASE 403A−03
ISSUE J
E
b
D
c
L1
L
A
A1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION b SHALL BE MEASURED WITHIN DIMENSION L1.
2.261
0.089
2.743
0.108
2.159
0.085
ǒ
mm
inches
Ǔ
SCALE 8:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
DIM
A
MIN NOM MAX MIN
MILLIMETERS
1.95 2.30 2.47 0.077
INCHES
A1 0.05 0.10 0.20 0.002
b 1.96 2.03 2.20 0.077
c 0.15 0.23 0.31 0.006
D 3.30 3.56 3.95 0.130
E 4.06 4.32 4.60 0.160
L 0.76 1.02 1.60 0.030
0.091 0.097
0.004 0.008
0.080 0.087
0.009 0.012
0.140 0.156
0.170 0.181
0.040 0.063
NOM MAX
5.21 5.44 5.60 0.205 0.214 0.220
H
E
0.51 REF
0.020 REF
D
L1
H
E
POLARITY INDICATOR
OPTIONAL AS NEEDED
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