1. Derate power dissipation linearly 1.33 mW/°C above 25°C.
2. RMA flux is recommended.
3. Methanol or isopropyl alcohols are recommended as cleaning
agents.
4. Soldering iron tip
1/16” (1.6mm) minimum from housing.
PACKAGE DIMENSIONS
FEATURES
• Opaque housing
• Low cost
• .035” apertures
• High I
C(ON)
Parameter Symbol Rating Unit
Operating Temperature T
OPR
-55 to +100 °C
Storage Temperature T
STG
-55 to +100 °C
Soldering Temperature (Iron)
(2,3 and 4)
T
SOL-I
240 for 5 sec °C
Soldering Temperature (Flow)
(2 and 3)
T
SOL-F
260 for 10 sec °C
INPUT (EMITTER)
Continuous Forward Current
I
F
50 mA
Reverse Voltage V
R
6V
Power Dissipation
(1)
P
D
100 mW
OUTPUT (SENSOR)
Collector to Emitter Voltage
V
CEO
30 V
Emitter to Collector Voltage V
ECO
4.5 V
Collector Current I
C
20 mA
Power Dissipation (T
C
= 25°C)
(1)
P
D
150 mW
ABSOLUTE MAXIMUM RATINGS
(T
A
= 25°C unless otherwise specified)
NOTES:
1. Dimensions for all drawings are in inches (mm).
2. Tolerance of ± .010 (.25) on all non-nominal dimensions
unless otherwise specified.
H21A1 / H21A2 / H21A3
PHOTOTRANSISTOR
OPTICAL INTERRUPTER SWITCH
DESCRIPTION
The H21A1, H21A2 and H21A3 consist of a
gallium arsenide infrared emitting diode
coupled with a silicon phototransistor in a
plastic housing. The packaging system is
designed to optimize the mechanical
resolution, coupling efficiency, ambient light
rejection, cost and reliability. The gap in the
housing provides a means of interrupting the
signal with an opaque material, switching the
output from an “ON” to an “OFF” state.