24-6337-8813

245 No-Clean Cored Wire for Lead-Free and

Leaded Alloys

Product Description

Kester 245 was developed to complement low residue liquid uxes being used by the electronics industry. The chemistry

is based on some of the same principles that have been safely used for years in mildly activated rosin uxes. The use of

245 results in visually acceptable assemblies without cleaning, yet soldering quality and efciency is comparable to that

obtained with mildly activated rosin ux. 245 was formerly classied as Type LR per MIL-F-14256. 245 is Bellcore GR-78

compliant.

Technical Data Sheet

2.6.15

Fluorides by Spot Test: Pass

Tested to J-STD-004, IPC-TM-650, Method

2.3.35.1

Chloride and Bromides: None

Detected

Tested to J-STD-004, IPC-TM-650, Method

2.3.35

RoHS Compliance

This product meets the requirements of the Restriction of Hazardous Substances (RoHS) Directive, 2011/65/EU for the

2

(in

2

Ω 2.1*10

9

Ω

Performance Characteristics:

■ Highly reliable post-soldering

■ Minimal residue

Health and Safety

This product, during handling or use, may be hazardous to your health or the environment. Read the Safety Data Sheet

(SDS) and warning label before using this product.

Storage and Shelf Life

Storage must be in a dry, non-corrosive environment. The surface may lose its shine and appear a dull shade of gray.

This is a surface phenomena and is not detrimental to product functionality. Flux cored solder wire has a limited shelf life

determined by the alloy used in the wire. For alloys containing more than 70% lead, the shelf life is two years from the

date of manufacture. Other alloys have a shelf life of three years from date of manufacture.

The 245 ux residues are non-corrosive, non-conductive and do not require removal in most applications. IPA will

lead free alloys. Please refer to www.kester.com for wire diameters, ux percentages and roll sizes that are available.

Note: Core size 50, 58 and 66 = 1.1%, 2.2% and 3.3% ux core.

Solder iron tip temperatures are most commonly between 315-343°C (600-650°F) for Sn63Pb37 and Sn62Pb36Ag02

alloys, and 371-400°C (700-750°F) for lead-free alloys. Heat both the land area and component lead to be soldered with

the iron prior to touching the land with the cored wire. Do not apply the wire directly to the soldering iron tip. If needed,

Kester 951 or 952-D6 no clean ux may be used as a compatible liquid ux to aid in reworking soldered joints. Kester 951

and 952-D6 are available in Flux-Pens