CC TSON C×R (AQY2)
–7–
ASCTB359E 201505-T
DIMENSIONS (mm inch)
SCHEMATIC AND WIRING DIAGRAMS
VIN: Input voltage, IIN: Input current, VL: Load voltage, IL: Load current
Schematic
Output
configuration
Load type Connection Wiring diagram
1a AC/DC
The CAD data of the products with a CAD Data mark can be downloaded from: http://industrial.panasonic.com/ac/e/
External dimensions
0.30
.012
1.025
.040
0.775
.031
C0.10 .004
1.50
.059
1.95
.077
12
4
3
1
2
3
4
Input: DC+
Input: DC
Output: AC/DC
Output: AC/DC
1.80
Lot No.
.071
0.80
.031
0.75
.030
0.40
.016
0.475
.019
0.65
.026
General tolerance: ±0.2 ±.008
Recommended mounting pad (Top view)
Tolerance: ±0.1 ±.004
0.75
.030
0.513
.020
0.60
1.025
.024
.040
0.40
.016
.059
1.50
0.575
.023
0.95
.037
0.75
.030
0.60
.024
CAD Data
1
2
4
3
Oscillation circuit
Rectifier circuit
Control circuit
1
I
IN
I
L
2
3
4
VL (AC,DC)
I
L
4
3
VL (AC,DC)
V
IN
Load
Load
CC TSON C×R (AQY2)
–8–
ASCTB359E 201505-T
CAUTIONS FOR USE
SAFETY WARNINGS
• Do not use the product under conditions
that exceed the range of its
specifications. It may cause overheating,
smoke, or fire.
• Do not touch the recharging unit while
the power is on. There is a danger of
electrical shock. Be sure to turn off the
power when performing mounting,
maintenance, or repair operations on the
device (including connecting parts such
as the terminal board and socket).
• Check the connection diagrams in the
catalog and be sure to connect the
terminals correctly. Erroneous
connections could lead to unexpected
operating errors, overheating, or fire.
1. Derating design
Derating is essential in any reliable
design and is a significant factor for
product life.
Even if the conditions of use
(temperature, current, voltage, etc.) of the
product fall within the absolute maximum
ratings, reliability can be reduced
remarkably when continually used under
high load (high temperature, high
humidity, high current, high voltage, etc.).
Therefore, please derate sufficiently
below the absolute maximum rating and
verify operation of the actual design
before use.
Also, if there is the possibility that the
inferior quality of this product could
possibility cause great adverse affect on
human life or physical property we
recommend that, from the perspective of
a manufacturer’s liability, sufficient
amount of derating to be added to the
maximum rating value and implement
safety measures such as fail-safe circuit.
2. Input voltage
For rising and dropping ratio of input
voltage(dv/dt), maintain min. 100mV/ms.
3. Applying stress that exceeds the
absolute maximum rating
If the voltage or current value for any of
the terminals exceeds the absolute
maximum rating, internal elements will
deteriorate because of the overvoltage or
overcurrent. In extreme cases, wiring
may melt, or silicon P/N junctions may be
destroyed.
Therefore, the circuit should be designed
in such a way that the load never exceed
the absolute maximum ratings, even
momentarily.
4. Oscillation circuit and control
circuit
The oscillation circuit and control circuit
of product may be destroyed by external
noise, surge, static electricity and so on.
For noise effect to peripheral circuits
when oscillation circuit operates, please
implement safety measures on the
system before use by verifying operation
under the actual design.
5. Deterioration and destruction
caused by discharge of static
electricity
This phenomenon is generally called
static electricity destruction, and occurs
when static electricity generated by
various factors is discharged while the
PhotoMOS
®
terminals are in contact,
producing internal destruction of the
element.
To prevent problems from static
electricity, the following precautions and
measures should be taken when using
your device.
(1) Employees handling PhotOMOS
®
should wear anti-static clothing and
should be grounded through protective
resistance of 500kΩ to 1MΩ.
(2) A conductive metal sheet should be
placed over the worktable. Measuring
instruments and jigs should be grounded.
(3) When using soldering irons, either
use irons with low leakage current, or
ground the tip of the soldering iron.
(Use of low-voltage soldering irons is also
recommended.)
(4) Devices and equipment used in
assembly should also be grounded.
(5) When packing printed circuit boards
and equipment, avoid using high-polymer
materials such as foam styrene, plastic,
and other materials which carry an
electrostatic charge.
(6) When storing or transporting
PhotoMOS
®
, the environment should not
be conducive to generating static
electricity (for instance, the humidity
should be between 45% and 60%), and
PhotoMOS
®
should be protected using
conductive packing materials.
6. Short across terminals
Do not short circuit between terminals
when device is energized, since there is
possibility of breaking of the internal IC.
7. Output spike voltages
1) If an inductive load generates spike
voltages which exceed the absolute
maximum rating, the spike voltage must
be limited.
Typical circuits of AC/DC dual use type
are shown below.
It is the same with DC only type.
2) Even if spike voltages generated at the
load are limited with a clamp diode if the
circuit wires are long, spike voltages will
occur by inductance. Keep wires as short
as possible to minimize inductance.
8. Reverse voltages at the input
If reverse voltages are present at the
input terminals, for example, connect a
schottky barrier diode in reverse parallel
across the input terminals and keep the
reverse voltages below the reverse
breakdown voltage. Typical circuit is
shown below.
9. Ripple in the input power supply
If ripple is present in the input power
supply, observe the following:
1) Please maintain the input voltage at
least 3V for E
min.
2) Please make sure the input voltage for
E
max. is no higher than 5.5V.
3) Please keep amplitude voltage of
ripple within ±0.5V.
1
2
3
4
1
2
3
4
Add a clamp diode
to the load
Add a CR snubber
circuit to the load
1
2
3
4
Emax.
Set voltage
within ±0.5V
within ±0.5V
Emin.
CC TSON C×R (AQY2)
–9–
ASCTB359E 201505-T
9. Soldering
When soldering surface-mount
terminals, TSON package, the following
conditions are recommended.
(1) IR (Infrared reflow) soldering method
(2) Soldering iron method
Tip temperature: 350 to 400°C 662 to
752°F
Wattage: 30 to 60 W
Soldering time: within 3 s
(3) Others
Check mounting conditions before using
other soldering methods (DWS, VPS, hot-
air, hot plate, laser, pulse heater, etc.)
When using lead-free solder, we
recommend a type with an alloy
composition of Sn 3.0 Ag 0.5 Cu. Please
inquire about soldering conditions and
other details.
The temperature profile indicates the
temperature of the soldered terminal on
the surface of the PC board. The ambient
temperature may increase excessively.
Check the temperature under mounting
conditions.
10. Notes for mounting
1) If many different packages are
combined on a single substrate, then
lead temperature rise is highly dependent
on package size. For this reason, please
make sure that the temperature of the
terminal solder area of the PhotoMOS
®
falls within the temperature conditions of
item “9. Soldering” before mounting.
2) If the mounting conditions exceed the
recommended solder conditions in item
“9. Soldering”, resin strength will fall and
the nonconformity of the heat expansion
coefficient of each constituent material
will increase markedly, possibly causing
cracks in the package, severed bonding
wires, and the like. For this reason,
please inquire with us about whether this
use is possible.
11. Cleaning solvents compatibility
We recommend cleaning with an organic
solvent. If you cannot avoid using
ultrasonic cleansing, please ensure that
the following conditions are met, and
check beforehand for defects.
• Frequency: 27 to 29 kHz
• Ultrasonic output: No greater than
0.25W/cm
2
• Cleaning time: No longer than 30 s
• Cleanser used: Asahiklin AK-225
• Other: Submerge in solvent in order to
prevent the PCB and elements from
being contacted directly by the ultrasonic
vibrations.
Note: Applies to unit area ultrasonic output for
ultrasonic baths.
12. Transportation and storage
1) Extreme vibration during transport will
damage the PhotoMOS
®
. Handle the
outer and inner boxes with care.
2) Storage under extreme conditions will
cause soldering degradation, external
appearance defects, and deterioration of
the characteristics. The following storage
conditions are recommended:
Temperature: 0 to 45°C 32 to 113°F
• Humidity: Less than 70%R.H.
• Atmosphere: No harmful gasses such
as sulfurous acid gas, minimal dust.
3) This PhotoMOS
®
implemented in
TSON is sensitive to moisture and come
in sealed moisture-proof package.
Observe the following cautions on
storage.
• After the moisture-proof package is
unsealed, take the devices out of storage
as soon as possible (within 1 month at
the most 45°C 113°F/70%R.H.).
• If the devices are to be left in storage for
a considerable period after the moisture-
proof package has been unsealed, it is
recommended to keep them in another
moisture-proof bag containing silica gel
(within 3 months at the most).
T
1
T
2
T
3
t1 t2
T1 = 150 to 180°C
T
2 = 230°C
T
3 = 245°C
t
1 = 60 to 120 s or less
t
2 = 30 s or less
302 to 356°F
446°F
473°F or less

AQY2C1R6P

Mfr. #:
Manufacturer:
Panasonic Industrial Devices
Description:
Solid State Relays - PCB Mount PhotoMOS CC TYPE,SMT TSON, 30V
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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