MCS 0402 AT, MCT 0603 AT, MCU 0805 AT, MCA 1206 AT - Precision
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Vishay Beyschlag
Revision: 21-Feb-17
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Document Number: 28785
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Notes
(1)
The quoted IEC standards are also released as EN standards with the same number and identical contents.
(2)
According to the detail specification EN 140401-801 the stability class applies to the category temperatures 85 °C and 125 °C and their
respective test conditions.
(3)
Tested on a 4-layer printed circuit board with SAC micro alloy.
4.22 6 (Fc) Vibration
Endurance by sweeping;
10 Hz to 2000 Hz;
no resonance;
amplitude 1.5 mm or
200 m/s
2
; 7.5 h
± (0.05 % R + 0.01)
no visible damage
4.17 58 (Td) Solderability
Solder bath method;
SnPb40; non-activated flux
(215 ± 3) °C; (3 ± 0.3) s
Good tinning ( 95 % covered);
no visible damage
Solder bath method;
SnAg3Cu0.5 or SnAg3.5;
non-activated flux;
(235 ± 3) °C; (2 ± 0.2) s
Good tinning (95 % covered);
no visible damage
4.18 58 (Td)
Resistance to
soldering heat
Solder bath method;
(260 ± 5) °C; (10 ± 1) s
± (0.05 % R + 0.01)
4.29 45 (XA)
Component solvent
resistance
Isopropyl alcohol +50 °C;
method 2
No visible damage
4.32 21 (Ue
3
) Shear (adhesion)
MCS 0402 AT and
MCT 0603 AT; 9 N
No visible damage
MCU 0805 AT and
MCA 1206 AT; 45 N
4.33 21 (Ue
1
) Substrate bending Depth 2 mm, 3 times
± (0.05 % R + 0.01)
no visible damage;
no open circuit in bent position
4.7 - Voltage proof U
RMS
= U
ins
; (60 ± 5) s No flashover or breakdown
4.35 - Flammability
IEC 60695-11-5
(1)
,
needle flame test; 10 s
No burning after 30 s
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE
IEC 60068-2
(1)
TEST
METHOD
TEST PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (R)
STABILITY CLASS 0.25 OR BETTER
(2)
Stability for product types:
MCS 0402 AT 47 to 221 k
MCT 0603 AT 47 to 511 k
MCU 0805 AT 47 to 1 M
MCA 1206 AT 47 to 1 M