120220-0161

Application Note:
APN-06001
ITT
Toupandun Industrial Area,
Jinda Cheng, Xiner Village,
Shajing Town, Baoan District,
Shenzhen City, PRC, 518125
Author Checked ECN/ECO Date Revision
Ken Taylor Ken Taylor R1E-1662 22 February 2006 -
Bills.Liu Tickner, David R1E-2455 27 October 2008 1
l Page 7 of 8
Damage contact
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Application Note:
APN-06001
ITT
Toupandun Industrial Area,
Jinda Cheng, Xiner Village,
Shajing Town, Baoan District,
Shenzhen City, PRC, 518125
Author Checked ECN/ECO Date Revision
Ken Taylor Ken Taylor R1E-1662 22 February 2006 -
Bills.Liu Tickner, David R1E-2455 27 October 2008 1
l Page 8 of 8
If the contact is in a misplaced position as detailed on ‘page 3’, the nozzle should touch the
beam during its travel down into the pocket and seat the contact down into the pocket.
Once the cover tape is removed from the pocket, if the vibration and shock of the feeding
mechanism on the machine is too violent, the contacts could jump out of position in the tape,
or even jump out of the pocket due to their low mass.
This situation can be controlled in the pick and place process by ensuring the shock of the
tape indexing is not too violent.

120220-0161

Mfr. #:
Manufacturer:
Description:
Conn Board to Board M 1 POS Solder ST SMD T/R
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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