NXP Semiconductors
BCM846BS
NPN/NPN matched double transistor
BCM846BS All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved
Product data sheet 26 June 2015 3 / 12
8. Limiting values
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
Per transistor
V
CBO
collector-base voltage open emitter - 80 V
V
CEO
collector-emitter voltage open base - 65 V
V
EBO
emitter-base voltage open collector - 6 V
I
C
collector current - 100 mA
I
CM
peak collector current single pulse; t
p
≤ 1 ms - 200 mA
P
tot
total power dissipation T
amb
≤ 25 °C [1] - 200 mW
Per device
P
tot
total power dissipation T
amb
≤ 25 °C [1] - 300 mW
T
j
junction temperature - 150 °C
T
amb
ambient temperature -55 150 °C
T
stg
storage temperature -65 150 °C
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
9. Thermal characteristics
Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Per transistor
R
th(j-a)
thermal resistance
from junction to
ambient
in free air [1] - - 625 K/W
Per device
R
th(j-a)
thermal resistance
from junction to
ambient
in free air [1] - - 416 K/W
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.