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0810 BU-SB10816 Page 2 of 2 Data Sheet 4378
Soldering Recommendations
• Compatible with lead and lead-free solder reflow processes
• Hand soldering - soldering tip should not directly touch part -
280°C max for 3 sec. max
• Peak reflow temperatures and durations:
- IR Reflow = 260°C max for 20 sec. max
- Wave Solder = 260°C max for 10 sec. max
Recommended IR Reflow Profile
Tape and Reel Packaging Specifications - mm
Dimensions - mm
Recommended Pad Layout - mm
GPP
1
XX
1
YY
1
Z
0.2 0.5 1 0.2 0.3 0.6 1.4 1.4
Note: Print solder 0.01~0.015mm thick.
BC D E L T W
0.2 0.3 0.2 0.5 2.5 0.5 1.0
±0.1 ±0.05 ±0.05 ±0.05 ±0.1 ±0.1 ±0.1
7RS7DSH
)
/
:
(
'
$
&
%
Unit: mm
AB C D E F LW
8.00 3.50 1.75 2.00 4.00 1.50 2.90 1.40
±0.30 ±0.05 ±0.10 ±0.05 ±0.10 ±0.10 ±0.20 ±0.20
Design Considerations
• Follow the soldering recommendations to avoid deforming product
• Do not use high temperature, high humidity or corrosive atmospheres
(sulfide and chloride gas) that could damage the solderability
• Moisture Sensitivity Level (MSL) according to J-STD-020 standard:
Level 2 (Floor Life 1 year under <30°C/65%RH conditions)
• Solderability requirement according to IPC/JEDEC J-STD-002C,
T
est D, Test B1
• Use Sn/Ag/Cu (96.5/3.0/0.5) or equivalent solder and activated flux #5
or equivalent.
Circuit Schematic
HDMI Application
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etwork Drive. All other copies of this document are by definition uncontrolled. This bulletin
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contained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications.
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support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be
reasonably expected to result in significant injury to the user.
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