© Semiconductor Components Industries, LLC, 2013
May, 2013 − Rev. 0
1 Publication Order Number:
NTLUS3A39PZC/D
NTLUS3A39PZC
Power MOSFET
−20 V, −5.2 A, Single P−Channel, ESD,
1.6x1.6x0.55 mm UDFN mCoolt Package
Features
• UDFN Package with Exposed Drain Pads for Excellent Thermal
Conduction
• Low Profile UDFN 1.6 x 1.6 x 0.55 mm for Board Space Saving
• Ultra Low R
DS(on)
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Applications
• Optimized for Power Management Applications for Portable
Products, Such as Cell Phones, PMP, Media Tablets, DSC, GPS, and
Others
• Battery Switch
• High Side Load Switch
MAXIMUM RATINGS (T
J
= 25°C unless otherwise stated)
Parameter
Symbol Value Unit
Drain-to-Source Voltage V
DSS
−20 V
Gate-to-Source Voltage V
GS
±8.0 V
Continuous Drain
Current (Note 1)
Continuous Drain
Current (Note 1)
Steady
State
T
A
= 25°C
I
D
−5.2
A
T
A
= 85°C −3.7
t ≤ 5 s T
A
= 25°C −6.4
Power Dissipa-
tion (Note 1)
Steady
State
T
A
= 25°C
P
D
1.5
W
t ≤ 5 s T
A
= 25°C 2.3
Continuous Drain
Current (Note 2)
Steady
State
T
A
= 25°C
I
D
−3.4
A
T
A
= 85°C −2.4
Power Dissipation (Note 2) T
A
= 25°C P
D
0.6 W
Pulsed Drain Current
tp = 10 ms
I
DM
−17 A
Operating Junction and Storage
Temperature
T
J
,
T
STG
-55 to
150
°C
Source Current (Body Diode) (Note 2) I
S
−1 A
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
T
L
260 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.127 in sq
[2 oz] including traces).
2. Surface-mounted on FR4 board using the minimum recommended pad size
of 30 mm
2
, 2 oz. Cu.
http://onsemi.com
P−Channel MOSFET
−20 V
50 mW @ −2.5 V
39 mW @ −4.5 V
R
DS(on)
MAX I
D
MAXV
(BR)DSS
MOSFET
UDFN6
(mCOOL])
CASE 517AU
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
ORDERING INFORMATION
AF = Specific Device Code
M = Date Code
G = Pb−Free Package
81 mW @ −1.8 V
MARKING DIAGRAM
147 mW @ −1.5 V
(Top View)
(*Note: Microdot may be in either location)
−5.2 A
S
D
G
1
6
AF MG
G
1
PIN CONNECTIONS