4
FN9073.9
October 21, 2015
Absolute Maximum Ratings Thermal Information
Supply Voltage, VCC (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . +7.0V
Absolute Boot Voltage, V
BOOT
. . . . . . . . . . . . . . . . . . . . . . . +15.0V
Upper Driver Supply Voltage, V
BOOT
- V
PHASE
. . . . . . . . . . . +6.0V
Input, Output or I/O Voltage . . . . . . . . . . . GND -0.3V to VCC +0.3V
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . -40°C to +85°C
Supply Voltage Range . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.3V ±10%
Thermal Resistance (Typical)
JA
(°C/W)
JC
(°C/W)
16 Ld SOIC (Note 2) . . . . . . . . . . . . . . 70 N/A
16 Ld TSSOP (Note 2) . . . . . . . . . . . . . 90 N/A
16 Ld QFN (Notes 3, 4) . . . . . . . . . . . . 35 4.5
Maximum Junction Temperature (Plastic Package) . -55°C to +150°C
Maximum Storage Temperature Range . . . . . . . . . .-65°C to +150°C
Pb-Free Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
1. Please refer to the Typical Application Schematics (page 3) for 3.3V/5V input configuration.
2.
JA
is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
3.
JA
is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
Tech Brief TB379.
4. For
JC
, the “case temp” location is the center of the exposed metal pad on the package underside.
Electrical Specifications Recommended operating conditions unless otherwise noted. Refer to “Functional Block Diagram” on page 2
and Typical Application Schematic beginning on page 2. V
CC
= +3.3V. Parameters with MIN and/or MAX limits
are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization and
are not production tested.
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
V
CC
SUPPLY
Shutdown Supply Current SYNC/EN = GND - 20 50 µA
Operating Supply Current (Note 5) RT = 64.9k 7 9.8 11.5 mA
REFERENCE VOLTAGE
Nominal Reference Voltage -0.8- V
Reference Voltage Tolerance -1.5 - 1.5 %
T
A
= 0°C to +70°C -1.8 - 1.8 %
T
A
= -40°C to +85°C -2.1 - 2.1 %
ERROR AMPLIFIER
Open Loop Voltage Gain (Note 6) - 82 - dB
Gain-Bandwidth Product (Note 6) 14 - - MHz
Slew Rate (Note 5) COMP = 10pF 4.65 6.0 9.2 V/
µs
CHARGE PUMP
Nominal Charge Pump Output V
CC
= 3.3V, No Load 4.8 5.1 5.5 V
Charge Pump Output Regulation -5.0 - 5.0 %
POWER-ON RESET
Rising CPVOUT POR Threshold T
A
= 0°C to +70°C 4.20 4.35 4.5 V
T
A
= -40°C to +85°C 4.1 4.35 4.6 V
CPVOUT POR Threshold Hysteresis 0.3 0.5 0.9 V
OSCILLATOR
Gate Output Frequency Range RT = 200k 80 100 120 kHz
RT = 64.9k 250 300 340 kHz
RT = 26.1k 650 715 770 kHz
Sawtooth Amplitude Peak-to-Peak V
OSC
1.1 1.4 1.7 V
Sync. Frequency Range (Note 6) 1.1x the natural switching frequency. 110 - 770 kHz
Minimum Sync Pulse Width (Note 6) - 40 100 ns
ISL6406
5
FN9073.9
October 21, 2015
PWM Maximum Duty Cycle -96-%
GATE DRIVER OUTPUT (Note 6)
Upper Gate Source Current V
BOOT
- V
PHASE
= 5V, V
UGATE
= 4V - -1 - A
Upper Gate Sink Current -1-A
Lower Gate Source Current V
VCC
= 3.3V, V
LGATE
= 4V - -1 - A
Lower Gate Sink Current -2-A
SOFT-START
Soft-Start Slew Rate f = 300kHz, T
A
= 0°C to +70°C 6.2 6.7 7.3 ms
f = 300kHz, T
A
= -40°C to +85°C 6.2 6.7 7.6 ms
Internal Digital Circuit Clock Count
(Soft-start time varies with frequency)
- 2048 - Clk Cycles
OVERCURRENT
OCSET Current Source T
A
= 0°C to +70°C 18 20 22 µA
T
A
= -40°C to +85°C 16 20 23 µA
NOTES:
5. This is the V
CC
current consumed when the device is active but not switching.
6. Limits established by characterization and are not production tested.
Electrical Specifications Recommended operating conditions unless otherwise noted. Refer to “Functional Block Diagram” on page 2
and Typical Application Schematic beginning on page 2. V
CC
= +3.3V. Parameters with MIN and/or MAX limits
are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization and
are not production tested. (Continued)
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
Typical Performance Curve
FIGURE 1. REFERENCE VOLTAGE vs TEMPERATURE
TEMPERATURE (°C)
-40-30-20-100 1020304050607080
0.810
0.805
0.800
0.795
0.790
0.785
0.780
V
REF
(V)
ISL6406
6
FN9073.9
October 21, 2015
Pin Descriptions
CPVOUT - This pin represents the output of the charge
pump. The voltage at this pin is the bias voltage for the IC.
Connect a decoupling capacitor from this pin to ground. The
value of the decoupling capacitor should be at least 10x the
value of the charge pump capacitor. This pin may be tied to
the bootstrap circuit as the source for creating the BOOT
voltage.
CT1 and CT2 - These pins are the connections for the
external charge pump capacitor. A minimum of a 0.1µF
ceramic capacitor is recommended for proper operation of
the IC.
OCSET - Connect a resistor (r
OCSET
) from this pin to the
drain of the upper MOSFET (V
IN
). r
OCSET
, an internal 20µA
current source (I
OCSET
), and the upper MOSFET
ON-resistance (r
DS(ON)
) set the converter overcurrent (OC)
trip point according to Equation 1:
An overcurrent trip cycles the soft-start function.
VOUT - This pin provides the external switcher output
voltage to the IC as feedback for the 1.8V fixed output
voltage option. Leave this pin open on the ISL6406 for the
adjustable output voltage option.
VCC - This pin provides bias supply for the ISL6406.
Connect a well-coupled 3.3V supply to this pin.
PHASE - Connect this pin to the upper MOSFET’s source.
This pin is used to monitor the voltage drop across the upper
MOSFET for overcurrent protection.
RT - Connect an external resistor from this pin to ground for
frequency selection. Refer to Figure 3 (RT vs Frequency).
BOOT - This pin provides ground referenced bias voltage to
the upper MOSFET driver. A bootstrap circuit is used to
create a voltage suitable to drive a logic-level N-Channel
MOSFET. A large (~1M) resistor should be connected from
this pin to GND. The purpose of this resistor is to discharge
the BOOT pin during a shutdown condition,
SYNC/EN = LOW so that the gate drivers are quickly
powered off by this bleed resistor.
UGATE - Connect this pin to the upper MOSFET’s gate. This
pin provides the PWM-controlled gate drive for the upper
MOSFET. This pin is also monitored by the adaptive
shoot-through protection circuitry to determine when the
upper MOSFET has turned off.
GND - This pin represents the signal and power ground for
the IC. Tie this pin to the ground island/plane through the
lowest impedance connection available.
LGATE - Connect this pin to the lower MOSFET’s gate. This
pin provides the PWM-controlled gate drive for the lower
MOSFET. This pin is also monitored by the adaptive
shoot-through protection circuitry to determine when the
lower MOSFET has turned off.
COMP and FB - COMP and FB are the available external
pins of the error amplifier. The FB pin is the inverting input of
the internal error amplifier and the COMP pin is the error
amplifier output. These pins are used to compensate the
control feedback loop of the converter.
CPGND - This pin represents the signal and power ground
for the charge pump. Tie this pin to the ground island/plane
through the lowest impedance connection available.
SYNC/EN - This is a dual-function pin. To synchronize with
an external clock, apply a clock with a frequency 1.1x to 2.0x
higher than the part’s natural frequency to this pin. The
device may be disabled by tying this pin to ground. In this
shutdown mode, all functions are disabled and the device
will draw <50µA supply current.
I
PEAK
I
OCSET
R
OCSET

r
DS ON
--------------------------------------------------------=
(EQ. 1)
ISL6406

ISL6406IV-T

Mfr. #:
Manufacturer:
Renesas / Intersil
Description:
IC REG CTRLR BUCK 16TSSOP
Lifecycle:
New from this manufacturer.
Delivery:
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