SI4116DY-T1-E3

Vishay Siliconix
Si4116DY
New Product
Document Number: 69837
S-83046-Rev. C, 22-Dec-08
www.vishay.com
1
N-Channel 25-V (D-S) MOSFET
FEATURES
Halogen-free According to IEC 61249-2-21
Available
TrenchFET
®
Power MOSFET
100 % R
g
and UIS Tested
APPLICATIONS
Synchronous Buck
- Low Side
PRODUCT SUMMARY
V
DS
(V) R
DS(on)
(Ω)
I
D
(A)
a
Q
g
(Typ.)
25
0.0086 at V
GS
= 10 V
18
17.5 nC
0.0095 at V
GS
= 4.5 V
17
0.0115 at V
GS
= 2.5 V
15.5
SO-8
SD
SD
SD
GD
5
6
7
8
Top View
2
3
4
1
Ordering Information: Si4116DY-T1-E3 (Lead (Pb)-free)
Si4116DY-T1-GE3 (Lead (Pb)-free and Halogen-free)
N-Channel MOSFET
G
D
S
Notes:
a. Based on T
C
= 25 °C.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. Maximum under Steady State conditions is 95 °C/W.
ABSOLUTE MAXIMUM RATINGS T
A
= 25 °C, unless otherwise noted
Parameter Symbol Limit Unit
Drain-Source Voltage
V
DS
25
V
Gate-Source Voltage
V
GS
± 12
Continuous Drain Current (T
J
= 150 °C)
T
C
= 25 °C
I
D
18
A
T
C
= 70 °C
14.3
T
A
= 25 °C
12.7
b, c
T
A
= 70 °C
10.1
b, c
Pulsed Drain Current
I
DM
50
Continuous Source-Drain Diode Current
T
C
= 25 °C
I
S
4.5
T
A
= 25 °C
2.2
b, c
Single Pulse Avalanche Current
L = 0.1 mH
I
AS
20
Avalanche Energy
E
AS
20
mJ
Maximum Power Dissipation
T
C
= 25 °C
P
D
5
W
T
C
= 70 °C
3.2
T
A
= 25 °C
2.5
b, c
T
A
= 70 °C
1.6
b, c
Operating Junction and Storage Temperature Range
T
J
, T
stg
- 55 to 150 °C
THERMAL RESISTANCE RATINGS
Parameter Symbol Typical Maximum Unit
Maximum Junction-to-Ambient
b, d
t 10 s
R
thJA
43 50
°C/W
Maximum Junction-to-Foot (Drain) Steady State
R
thJF
19 25
www.vishay.com
2
Document Number: 69837
S-83046-Rev. C, 22-Dec-08
Vishay Siliconix
Si4116DY
New Product
Notes
a. Pulse test; pulse width 300 µs, duty cycle 2 %
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
SPECIFICATIONS T
J
= 25 °C, unless otherwise noted
Parameter Symbol Test Conditions Min. Typ. Max. Unit
Static
Drain-Source Breakdown Voltage
V
DS
V
GS
= 0 V, I
D
= 250 µA
25 V
V
DS
Temperature Coefficient ΔV
DS
/T
J
I
D
= 250 µA
30
mV/°C
V
GS(th)
Temperature Coefficient ΔV
GS(th)
/T
J
- 4.0
Gate-Source Threshold Voltage
V
GS(th)
V
DS
= V
GS
, I
D
= 250 µA
0.6 1.4 V
Gate-Source Leakage
I
GSS
V
DS
= 0 V, V
GS
= ± 12 V
± 100 nA
Zero Gate Voltage Drain Current
I
DSS
V
DS
= 25 V, V
GS
= 0 V
1
µA
V
DS
= 25 V, V
GS
= 0 V, T
J
= 55 °C
10
On-State Drain Current
a
I
D(on)
V
DS
5 V, V
GS
= 10 V
30 A
Drain-Source On-State Resistance
a
R
DS(on)
V
GS
= 10 V, I
D
= 10 A
0.0071 0.0086
Ω
V
GS
= 4.5 V, I
D
= 7 A
0.0078 0.0095
V
GS
= 2.5 V, I
D
= 5 A
0.009 0.0115
Forward Transconductance
a
g
fs
V
DS
= 15 V, I
D
= 10 A
68 S
Dynamic
b
Input Capacitance
C
iss
V
DS
= 15 V, V
GS
= 0 V, f = 1 MHz
1925
pFOutput Capacitance
C
oss
305
Reverse Transfer Capacitance
C
rss
135
Total Gate Charge
Q
g
V
DS
= 15 V, V
GS
= 10 V, I
D
= 10 A
37 56
nC
V
DS
= 15 V, V
GS
= 4.5 V, I
D
= 10 A
17.5 27
Gate-Source Charge
Q
gs
3.7
Gate-Drain Charge
Q
gd
3.3
Gate Resistance
R
g
f = 1 MHz 1.6 3.0 Ω
Tur n - O n D e l ay Time
t
d(on)
V
DD
= 15 V, R
L
= 1.5 Ω
I
D
10 A, V
GEN
= 4.5 V, R
g
= 1 Ω
13 25
ns
Rise Time
t
r
11 20
Turn-Off Delay Time
t
d(off)
50 90
Fall Time
t
f
15 30
Tur n - O n D e l ay Time
t
d(on)
V
DD
= 15 V, R
L
= 1.5 Ω
I
D
10 A, V
GEN
= 10 V, R
g
= 1 Ω
714
Rise Time
t
r
10 20
Turn-Off Delay Time
t
d(off)
31 55
Fall Time
t
f
918
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
I
S
T
C
= 25 °C
4.5
A
Pulse Diode Forward Current
a
I
SM
50
Body Diode Voltage
V
SD
I
S
= 3 A
0.69 1.1 V
Body Diode Reverse Recovery Time
t
rr
I
F
= 5 A, dI/dt = 100 A/µs, T
J
= 25 °C
26 45 ns
Body Diode Reverse Recovery Charge
Q
rr
16 30 nC
Reverse Recovery Fall Time
t
a
13
ns
Reverse Recovery Rise Time
t
b
13
Document Number: 69837
S-83046-Rev. C, 22-Dec-08
www.vishay.com
3
Vishay Siliconix
Si4116DY
New Product
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
Output Characteristics
On-Resistance vs. Drain Current and Gate Voltage
Gate Charge
0
10
20
30
40
50
0.0 0.5 1.0 1.5 2.0 2.5
V
DS
- Drain-to-Source Voltage (V)
- Drain Current (A)I
D
V
GS
=10thru 3 V
V
GS
=2V
0.0070
0.0073
0.0076
0.0079
0.0082
0.0085
0 1020304050
- On-Resistance (Ω)R
DS(on)
I
D
- Drain Current (A)
V
GS
=10V
V
GS
=4.5V
0
2
4
6
8
10
0 8 16 24 32 40
I
D
=10A
- Gate-to-Source Voltage (V)
Q
g
- Total Gate Charge (nC)
V
GS
V
DS
=20V
V
DS
=10V
V
DS
=15V
Transfer Characteristics
Capacitance
On-Resistance vs. Junction Temperature
0.0
0.4
0.8
1.2
1.6
2.0
0.0 0.6 1.2 1.8 2.4 3.0
V
GS
- Gate-to-Source Voltage (V)
- Drain Current (A)I
D
T
C
= 25 °C
T
C
= 125 °C
T
C
= - 55 °C
C
rss
0
500
1000
1500
2000
2500
0 5 10 15 20 25
C
oss
C
iss
V
DS
- Drain-to-Source Voltage (V)
C - Capacitance (pF)
0.6
0.9
1.2
1.5
1.8
- 50 - 25 0 25 50 75 100 125 150
T
J
-Junction Temperature (°C)
(Normalized)
- On-Resistance
R
DS(on)
I
D
=10A
V
GS
=10V
V
GS
=4.5V

SI4116DY-T1-E3

Mfr. #:
Manufacturer:
Vishay / Siliconix
Description:
MOSFET 25V Vds 12V Vgs SO-8
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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