CPDQC5V0U-HF
Page 1
QW-G7067
REV:D
Features
Mechanical data
- Case: 0402C/SOD-923F standard package,
molded plastic.
- Mounting position: Any.
- Weight: 0.001 grams(approx.).
Comchip Technology CO., LTD.
RoHS Device
Halogen Free
- Terminals: Gold plated, solderable per
MIL-STD-750, method 2026.
Circuit diagram
Company reserves the right to improve product design , functions and reliability without notice.
SMD ESD Protection Diode
Symbol
Typ
Parameter
Min
Max
Unit
Conditions
Breakdown voltage
VBR V
IT = 1mA
6
Reverse leakage current
IR µA
VRWM = 5V
2.0
Clamping voltage
V
Working peak reverse voltage
VRWM
5.0
Junction capacitance
CJ
pF
VR = 0V, f = 1MHz
Electrical Characteristics (at TA=25°C unless otherwise noted)
Forward voltage
VF V
IF = 10mA
1.2
Maximum Rating (at TA=25°C unless otherwise noted)
Symbol
Parameter
Value
Unit
Conditions
Peak pulse power
PPP W
180
Operation temperature range
Tj
°C
Storage temperature range
TSTG
-55~+150
°C
ESD
kV
IEC 61000-4-2(air)
IEC 61000-4-2(contact)
ESD capability
-40~+125
Peak pulse current
IPP A
TP = 8/20us
15
TP = 8/20us
±30
ESD
±30
130
0.8
0.2
VC
V
7.6
IPP = 1A, TP = 8/20us
IPP = 5A, TP = 8/20us
9.4
IPP = 15A, TP = 8/20us
12
8
10
- Uni-directional ESD protection.
- Surface mount package.
- Ultra small SMD package:0402.
- High component density.
- IEC 61000-4-2 (ESD) ; ±30KV(contact)
Dimensions in inches and (millimeter)
0402C/SOD-923F
0.022(0.55)
0.018(0.45)
0.001(0.02)
Max.
0.041(1.05)
0.037(0.95)
0.026(0.65)
BSC.
0.012(0.30)
0.008(0.20)
0.022(0.55)
0.018(0.45)
0.026(0.65)
0.022(0.55)
