TCK22922G,LF

TCK2292xG, TCK2297xG
2017-10-18
7
© 2017
Toshiba Electronic Devices & Storage Corporation
Application Note
1. Application circuit example (top view)
The figure below shows the recommended configuration
1) Input capacitor
An input capacitor (C
IN
) is highly recommended for the stable operation. And it is effective to reduce voltage overshoot
or undershoot due to sharp changes in output current and also for improved stability of the power supply. When used,
place C
IN
more than 1.0μF as close to V
IN
pin to improve stability of the power supply.
2) Output capacitor
An output capacitor (C
OUT
) is not necessary for the guaranteed operation. However, there is a possibility of overshoot
or undershoot caused by output load transient response, board layout and parasitic components of load switch IC. In this
case, an output capacitor with C
OUT
more than 0.1μF us recommended.
3) Control pin
The Control pin controls both the pass-through p-ch MOSFET and the discharge n-ch MOSFET (only for TCK2292xG),
operated by the control voltage and Schmitt trigger. Also, pull down resistance equivalent to a few MΩ is connected
between Control and GND, thus the load switch IC is in OFF state even when Control pin is OPEN. (except TCK22975G).
A control pins for TCK22975G is Active low. Products that Control pin is an open connection, please use be sure to fix the
potential of the Control pin to High or Low.
2. Reverse current blocking
This device has a built-in Reverse current blocking (SW OFF state) circuit to block reverse current from V
OUT
to V
IN
when output n-ch MOSEFT turned off and input voltage is 0V.
3. Instructions and directions for use
This device has a built-in several functions, but these does not assure for the suppression of uprising device operation. In
use of these products, please read through and understand dissipation idea for absolute maximum ratings from the above
mention or our Semiconductor Reliability Handbook. Then use these products under absolute maximum ratings in any
condition. Furthermore, Toshiba recommend inserting failsafe system into the design.
Control
Voltage
Output
Voltage
HIGH ON
LOW OFF
OPEN OFF
V
OUT
GND
V
IN
Control
C
L
R
L
LOAD
C
IN
TCK2292xG, TCK2297xG
2017-10-18
8
© 2017
Toshiba Electronic Devices & Storage Corporation
4.
Power Dissipation
Power dissipation is measured on the board condition shown below.
[The Board Condition]
Board material: Glass epoxy (FR4)
Board dimension: 40mm x 40mm (both sides of board)t=1.6mm
Metal pattern ratio: a surface approximately 50%, the reverse side approximately 50%
Through hole: diameter 0.5mm x 28
Please allow sufficient margin when designing a board pattern to fit the expected power dissipation. Also take into
consideration the ambient temperature, input voltage, output current etc. and applying the appropriate derating for allowable
power dissipation during operation.
0
200
400
600
800
1000
-40 0 40 80 120
Power Dissipation P
D
(mW)
Ambient Temperature Ta (℃)
P
D
- Ta
TCK2292xG, TCK2297xG
2017-10-18
9
© 2017
Toshiba Electronic Devices & Storage Corporation
Package dimension
Weight: 1 mg (typ.)
Unit: mm

TCK22922G,LF

Mfr. #:
Manufacturer:
Toshiba
Description:
Power Switch ICs - Power Distribution Load Switch 2.0A 1.1V to 5.5V
Lifecycle:
New from this manufacturer.
Delivery:
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