TCK2292xG, TCK2297xG
2017-10-18
Toshiba Electronic Devices & Storage Corporation
Absolute Maximum Ratings (Ta = 25°C)
Characteristics Symbol Rating Unit
Input voltage V
IN
-0.3 to 6.0 V
Control voltage V
CT
-0.3 to 6.0 V
Output voltage V
OUT
-0.3 to 6.0 V
Output current I
OUT
DC 2.0 A
Pulse 3.0 (Note1) A
Power dissipation
P
D
800 (Note 2) mW
Operating temperature range
T
opr
-40 to 85 °C
Junction temeperature
Tj 150 °C
Storage temperature T
stg
-55 to 150 °C
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant
change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating
conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the
appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling
Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated
failure rate, etc).
Note1: 100 μs pulse, 2% duty cycle
Note2: Rating at mounting on a board
Board material: Glass epoxy (FR4)
Board dimension: 40mm x 40mm (both sides of board), t=1.6mm
Metal pattern ratio: a surface approximately 50%, the reverse side approximately 50%
Through hole: diameter 0.5mm x 28
Operating conditions
Characteristics Symbol Condition Min Max Unit
Input voltage V
IN
― 1.1 5.5 V
Output voltage V
OUT
― ― V
IN
V
Output current I
OUT
1.4V < V
IN
― 2.0 A
Control High-level input voltage V
IH
1.2V < V
IN
≤ 5.5 V 1.0 ―
V
1.1V ≤ V
IN
≤1.2 V 0.9 ―
Control Low-level input voltage V
IL
― ― 0.4 V
Pin Assignment(Top view) Top marking
Index
VOUT
A1: V
OUT
B1: V
OUT
C1: GND
A2: V
IN
B2: V
IN
C2: Control
1
2
A
B C
Lot trace code
Device Marking
