AO4813_002

AO4813
30V Dual P-Channel MOSFET
General Description Product Summary
V
DS
I
D
(at V
GS
=-10V) -7.1A
R
DS(ON)
(at V
GS
=-10V) < 25m
R
DS(ON)
(at V
GS
= -4.5V) < 40m
100% UIS Tested
100% R
g
Tested
Symbol
V
DS
V
GS
I
DM
I
AS
, I
AR
E
AS
, E
AR
T
J
, T
STG
Symbol
t 10s
Steady-State
Steady-State
R
θJL
°C
Thermal Characteristics
W
2
1.3
T
A
=70°C
Junction and Storage Temperature Range -55 to 150
UnitsParameter Typ Max
°C/W
R
θJA
48
74
62.5
Maximum Junction-to-Ambient
A
V±20Gate-Source Voltage
mJ
Avalanche Current
C
36
A-27
A
The AO4813 combines advanced trench MOSFET
technology with a low resistance package to provide
extremely low R
DS(ON)
. This device is ideal for load switch
and battery protection applications.
V
Maximum UnitsParameter
Absolute Maximum Ratings T
A
=25°C unless otherwise noted
-30V
-7.1
-5.6
-40
Drain-Source Voltage -30
T
A
=25°C
T
A
=70°C
Power Dissipation
B
P
D
Avalanche energy L=0.1mH
C
Pulsed Drain Current
C
Continuous Drain
Current
T
A
=25°C
I
D
Maximum Junction-to-Lead
°C/W
°C/W
Maximum Junction-to-Ambient
A D
32
90
40
G
D
S
G1
S1
G2
S2
D1
D1
D2
D2
2
4
5
1
3
8
6
7
Top View
SOIC-8
Top View Bottom View
Pin1
G
D
S
Rev 9: April 2011 www.aosmd.com Page 1 of 6
AO4813
Symbol Min Typ Max Units
BV
DSS
-30 V
V
DS
=-30V, V
GS
=0V -1
T
J
=55°C -5
I
GSS
±100 nA
V
GS(th)
Gate Threshold Voltage
-1.5 -2.0 -2.5 V
I
D(ON)
-40 A
17 25
T
J
=125°C 24 33
27 40 m
g
FS
24 S
V
SD
-0.75 -1 V
I
S
-2.5 A
C
iss
1040 1250 pF
C
oss
180 pF
C
rss
125 175 pF
R
g
2 4 6
Q
g
(10V) 19 nC
Q
g
(4.5V) 9.6 nC
Q
gs
3.6 nC
Q
gd
4.6 nC
t
D(on)
10 ns
t
r
5.5 ns
t
D(off)
26 ns
t
f
9 ns
t
rr
11.5 ns
Q
rr
25
nC
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
Body Diode Reverse Recovery Charge
I
F
=-7.1A, dI/dt=500A/µs
Maximum Body-Diode Continuous Current
Input Capacitance
Output Capacitance
Turn-On DelayTime
DYNAMIC PARAMETERS
Turn-On Rise Time
Turn-Off DelayTime
V
GS
=-10V, V
DS
=-15V, R
L
=2.2,
R
GEN
=3
Gate resistance
V
GS
=0V, V
DS
=0V, f=1MHz
Reverse Transfer Capacitance
Turn-Off Fall Time
Total Gate Charge
V
GS
=-10V, V
DS
=-15V, I
D
=-7.1A
Gate Source Charge
Gate Drain Charge
Total Gate Charge
On state drain current
I
S
=-1A,V
GS
=0V
V
DS
=-5V, I
D
=-7.1A
V
GS
=-4.5V, I
D
=-5.6A
Forward Transconductance
Diode Forward Voltage
V
GS
=-10V, V
DS
=-5V
V
GS
=-10V, I
D
=-7.1A
R
DS(ON)
Static Drain-Source On-Resistance
I
DSS
µA
V
DS
=V
GS
I
D
=-250µA
V
DS
=0V, V
GS
= ±20V
Zero Gate Voltage Drain Current
Gate-Body leakage current
m
I
F
=-7.1A, dI/dt=500A/µs
V
GS
=0V, V
DS
=-15V, f=1MHz
SWITCHING PARAMETERS
Electrical Characteristics (T
J
=25°C unless otherwise noted)
STATIC PARAMETERS
Parameter Conditions
Body Diode Reverse Recovery Time
Drain-Source Breakdown Voltage
I
D
=-250µA, V
GS
=0V
A. The value of R
θJA
is measured with the device mounted on 1in
2
FR-4 board with 2oz. Copper, in a still air environment with T
A
=25°C. The
value in any given application depends on the user's specific board design.
B. The power dissipation P
D
is based on T
J(MAX)
=150°C, using 10s junction-to-ambient thermal resistance.
C. Repetitive rating, pulse width limited by junction temperature T
J(MAX)
=150°C. Ratings are based on low frequency and duty cycles to keep
initialT
J
=25°C.
D. The R
θJA
is the sum of the thermal impedence from junction to lead R
θJL
and lead to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-ambient thermal impedence which is measured with the device mounted on 1in
2
FR-4 board with
2oz. Copper, assuming a maximum junction temperature of T
J(MAX)
=150°C. The SOA curve provides a single pulse ratin g.
Rev 9: April 2011 www.aosmd.com Page 2 of 6
AO4813
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS
17
5
2
10
0
18
40
0
10
20
30
40
0 1 2 3 4 5
-V
GS
(Volts)
Figure 2: Transfer Characteristics (Note E)
-I
D
(A)
10
15
20
25
30
35
0 5 10 15 20
-I
D
(A)
Figure 3: On-Resistance vs. Drain Current and
Gate Voltage (Note E)
R
DS(ON)
(m
)
1.0E-05
1.0E-04
1.0E-03
1.0E-02
1.0E-01
1.0E+00
1.0E+01
1.0E+02
0.0 0.2 0.4 0.6 0.8 1.0 1.2
-V
SD
(Volts)
Figure 6: Body-Diode Characteristics (Note E)
-I
S
(A)
25°C
125°C
0.8
1
1.2
1.4
1.6
1.8
0 25 50 75 100 125 150 175
Temperature C)
Figure 4: On-Resistance vs. Junction Temperature
(Note E)
Normalized On-Resistance
V
GS
=-4.5V
I
D
=-5.6A
V
GS
=-10V
I
D
=-7.1A
10
20
30
40
50
60
2 4 6 8 10
-V
GS
(Volts)
Figure 5: On-Resistance vs. Gate-Source Voltage
(Note E)
R
DS(ON)
(m
)
25°C
125°C
V
DS
=-5V
V
GS
=-4.5V
V
GS
=-10V
I
D
=-7.1A
25°C
125°C
0
10
20
30
40
50
60
0 1 2 3 4 5
-V
DS
(Volts)
Fig 1: On-Region Characteristics (Note E)
-I
D
(A)
V
GS
=-3.0V
-3.5V
-7V-10V
-4.5V
-5V
Rev 9: April 2011 www.aosmd.com Page 3 of 6

AO4813_002

Mfr. #:
Manufacturer:
Description:
MOSFET P-CH DUAL 8SOIC
Lifecycle:
New from this manufacturer.
Delivery:
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