NXP Semiconductors
PMCM440VNE
12 V, N-channel Trench MOSFET
PMCM440VNE All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2015. All rights reserved
Product data sheet 7 April 2015 5 / 15
Symbol Parameter Conditions Min Typ Max Unit
R
th(j-sp)
thermal resistance
from junction to solder
point
- 5 10 K/W
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for drain, 4-layer, 1 cm
2
.
[3]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for drain 6 cm
2
.
aaa-013734
t
p
(s)
10
-3
10
2
10
3
10110
-2
10
-1
10
2
10
10
3
Z
th(j-a)
(K/W)
1
duty cycle = 1
0.01
0.75
0.50
0.33
0.25
0.20
0.10
0.05
0.02
0
FR4 PCB, standard footprint
Fig. 5. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
aaa-013735
t
p
(s)
10
-3
10
2
10
3
10110
-2
10
-1
10
10
2
Z
th(j-a)
(K/W)
1
duty cycle = 1
0.01
0.75
0.50
0.33
0.25
0.20
0.10
0.05
0.02
0
FR4 PCB, mounting pad for drain 6 cm
2
Fig. 6. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values