2
Technical Data 10465
Effective October 2015
FP1109B
High frequency, high current power inductors
www.eaton.com/elx
Product specifications
Part Number
7
OCL
1
(nH)±10%
FLL
2
(nH) minimum
I
rms
3
(amps)
I
sat
1
4
(amps)
I
sat
2
5
(amps)
DCR (mΩ)
@ 20°C ±5% K-factor
8
FP1109B1-R150-R 150 108 55 80 64 0.19 339
FP1109B1-R180-R 180 130 55 62 49 0.19 339
FP1109B1-R220-R 220 158 55 50 40 0.19 339
FP1109B1-R300-R 300 216 55 38 30 0.19 339
1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.1Vrms, 0.0Adc, +25ºC
2. Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, I
sat
1, +25ºC
3. I
rms
: DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary
for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generat-
ing components will affect the temperature rise. It is recommended that the temperature of the part
not exceed 125°C under worst case operating conditions verified in the end applicat ion.
4. I
sat
1: Peak current for approximately 20% rolloff @ +25°C
5. I
sat
2: Peak current for approximately 20% rolloff @ +125°C
6. K-factor: Used to determine B
p-p
for core loss (see graph).
B
p-p
= K * L * ∆I * 10
-3
. B
p-p
:(Gauss), K: (K-factor from table),
L: (Inductance in nH), ∆I (Peak-to-peak ripple current in Amps).
7. Part Number Definition: FP1109Bx-Rxxx-R
FP1109B= Product code and size
x= version indicator
Rxxx= Inductance value in μH, R= decimal point
-R suffix = RoHS compliant
Dimensions (mm)
Part marking: FP1109Bx (Product code and size, x = version indicator),
Rxxx = Inducutance value in uh, R = decimal point
wwllyy = date code, R = revision level
All soldering surface to be coplanar within 0.10mm
DCR measured between point “a” and point “b”
Recommended Pad Layout Schematic
