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AT24C64-10TI-1.8

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P19
13
AT24C32/64
0336K–SEEPR–7/03
Note: For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC characteristics tables.
AT24C32 Ordering Information
Ordering Code Package Operation Range
AT24C32-10PI-2.7
AT24C32N-10SI-2.7
AT24C32W-10SI-2.7
8P3
8S1
8S2
Industrial
(-40°C to 85°C)
AT24C32-10PI-1.8
AT24C32N-10SI-1.8
AT24C32W-10SI-1.8
8P3
8S1
8S2
Industrial
(-40°C to 85°C)
Package Type
8P3 8-lead, 0.300” Wide, Plastic Dual Inline Package (PDIP)
8S1 8-lead, 0.150” Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8S2 8-lead, 0.200” Wide, Plastic Gull Wing Small Outline (EIAJ SOIC)
Options
-2.7 Low Voltage (2.7V to 5.5V)
-1.8 Low Voltage (1.8V to 5.5V)
14
AT24C32/64
0336K–SEEPR–7/03
Note: For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC characteristics tables.
AT24C64 Ordering Information
Ordering Code Package Operation Range
AT24C64-10PI-2.7
AT24C64N-10SI-2.7
AT24C64W-10SI-2.7
AT24C64-10TI-2.7
8P3
8S1
8S2
8A2
Industrial
(-40°C to 85°C)
AT24C64-10PI-1.8
AT24C64N-10SI-1.8
AT24C64W-10SI-1.8
AT24C64-10TI-1.8
8P3
8S1
8S2
8A2
Industrial
(-40°C to 85°C)
Package Type
8P3 8-lead, 0.300” Wide, Plastic Dual Inline Package (PDIP)
8S1 8-lead, 0.150” Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8S2 8-lead, 0.200” Wide, Plastic Gull Wing Small Outline (EIAJ SOIC)
8A2 8-lead, 0.170” Wide, Thin Shrink Small Outline Package (TSSOP)
Options
-2.7 Low Voltage (2.7V to 5.5V)
-1.8 Low Voltage (1.8V to 5.5V)
15
AT24C32/64
0336K–SEEPR–7/03
Packaging Information
8P3 – PDIP
2325 Orchard Parkway
San Jose, CA 95131
TITLE
DRAWING NO.
R
REV.
8P3, 8-lead, 0.300" Wide Body, Plastic Dual
In-line Package (PDIP)
01/09/02
8P3
B
D
D1
E
E1
e
L
b2
b
A2 A
1
N
eA
c
b3
4 PLCS
Top View
Side View
End View
COMMON DIMENSIONS
(Unit of Measure = inches)
SYMBOL
MIN
NOM
MAX
NOTE
Notes: 1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA for additional information.
2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3.
3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch.
4. E and eA measured with the leads constrained to be perpendicular to datum.
5. Pointed or rounded lead tips are preferred to ease insertion.
6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm).
A 0.210 2
A2 0.115 0.130 0.195
b 0.014 0.018 0.022 5
b2 0.045 0.060 0.070 6
b3 0.030 0.039 0.045 6
c 0.008 0.010 0.014
D 0.355 0.365 0.400 3
D1 0.005 3
E 0.300 0.310 0.325 4
E1 0.240 0.250 0.280 3
e 0.100 BSC
eA 0.300 BSC 4
L 0.115 0.130 0.150 2
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P19

AT24C64-10TI-1.8

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Description:
IC EEPROM 64K I2C 400KHZ 8TSSOP
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