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PACKAGE OUTLINE
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PCB METAL & VIA HOLE
TOP (X-Ray) VIEW
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PCB SOLDER MASK
TOP (X-Ray) VIEW
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PCB SOLDER STENCIL
TOP (X-Ray) VIEW
RECOMMENDED FOOTPRINT NOTES:
4. VIA HOLE INFORMATION:
4a. RECOMMENDED VIA HOLE SIZE (Ø): 0.150 - 0.300mm
4b. RECOMMENDED VIA HOLE PITCH: AS SHOWN
4c. RECOMMENDED VIA WALL Cu PLATING: 30-35um
4d. RECOMMENDED THAT VIAS BE TENTED WITH SOLDERMASK ON PCB BACKSIDE AND
FILLED WITH SOLDER.
4e. VIA IN SIGNAL PAD DETAIL, TYP 7 PLCS.
4f. TOTAL VIA COUNT AS SHOWN: 23.
5. SOLDER MASK GEOMETRY FEATURES:
5a. ALL PERIPHERAL PCB PADS ARE NON-SOLDER MASK DEFINED.
5b. ALL GROUND PADDLE FEATURES ARE SOLDER MASK DEFINED.
6. SOLDER STENCIL APERTURE FEATURES:
6a. SOLDER STENCIL APERATURE OPENINGS ARE SMALLER THEN PERIPHERAL PCB METAL PADS.
6b. RECOMMENDED SOLDER STENCIL APERTURE ARRAY TO TARGET APPROXIMATELY
50 - 80% COVERAGE OF SOLDER MASK OPENINGS, EXCEPT AS NOTED.
7. RECOMMENDED SOLDER STENCIL THICKNESS: 5.0mils (0.127mm).
8. PCB ACAD AND GERBER FILES AVAILABLE UPON REQUEST.
GENERAL NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. DIMENSIONING AND TOLERANCES CONFORM TO ASME Y14.5M-1994.
(UNLESS OTHERWISE SPECIFIED THE FOLLOWING VALUES APPLY)
DECIMAL TOLERANCE: ANGULAR TOLERANCE:
X.X (1 PLC) ± 0.1mm ± 1°
X.XX (2 PLC) ± 0.05mm
X.XXX (3 PLC) ± 0.025mm
3. UNLESS SPECIFIED DIMENSIONS ARE SYMMETRICAL ABOUT CENTER LINES.
PERIPHERAL PAD
PATTERN DETAIL
