For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
VCOS - SMT
12
12 - 153
Outline Drawing
NOTES:
11. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS]
3. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.
4. PAD BURR LENGTH SHALL BE 0.15mm MAXIMUM.
PAD BURR HEIGHT SHALL BE 0.05mm MAXIMUM.
5. PACKAGE WARP SHALL NOT EXCEED 0.05mm.
6. ALL GROUND LEADS AND GROUND PADDLE MUST BE
SOLDERED TO PCB RF GROUND.
7. REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED LAND PATTERN.
HMC533LP4 / 533LP4E
MMIC VCO w/ DIVIDE-BY-16,
23.8 - 24.8 GHz
v00.0405
Part Number Package Body Material Lead Finish MSL Rating Package Marking
[3]
HMC533LP4 Low Stress Injection Molded Plastic Sn/Pb Solder
MSL1
[1]
H533
XXXX
HMC533LP4E RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn
MSL1
[2]
H533
XXXX
[1] Max peak re ow temperature of 235 °C
[2] Max peak re ow temperature of 260 °C
[3] 4-Digit lot number XXXX
Package Information
Pin Descriptions
Pin Number Function Description Interface Schematic
1, 15, 17,
21, 23
GND
Package bottom has an exposed metal paddle that
must also be connected to RF/DC ground.
2RFOUT/16 Divided-by-16 Output
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
For price, delivery, and to place orders: Analog Devices, Inc.,
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
Application Support: Phone: 1-800-ANALOG-D