NCP1599
http://onsemi.com
13
of the converter. A higher bandwidth generally corresponds
to faster response times and lower overshoots to load
transients. However, the bandwidth should not be much
higher than 1/10 the switching frequency. The NCP1599
operates with a 1.0 MHz switching frequency, so it is
recommended to choose a crossover frequency between
40 kHz 100 kHz. The schematic of the NCP1599
compensator is shown in Figure 2. The default design uses
Rc and CC1 to form a lag (Type 2) compensator. The CC2
capacitor can be added to form an additional pole that is
typically used to cancel out the ESR zero of the output
capacitor. Finally, if extra phase margin is needed, the C
FF
capacitor can be added (this does not help at low output
voltages, see below). The strategy taken here for choosing
Rc and CC1 is to set the crossover frequency with Rc, and set
the compensator zero with CC1.
Using the selected target crossover frequency, fc, set Rc to:
R
C
+
2p @ f
C
@ C
out
Gm
EA
@ G
CS
@
V
out
V
FB
W
(eq. 11)
fC = Crossover frequency in Hertz (50kHz 200kHz is
recommended).
The zero, due to the compensation capacitor (Cc1) and the
compensation resistor (Rc), is located at:
f
Z1
+
1
2p C
C1
R
C
(eq. 12)
When fast transient responses are desired, fZ1 should be
placed as high as possible, however it should not be higher
than the selected crossover frequency fc. The guideline
proposed here is to choose CC1 such that fZ1 falls somewhere
between the power pole fP1 and 12 decade before the
selected crossover frequency fc:
3.16
2p R
C
f
C
v C
C1
v
1
2p f
p1
R
C
(eq. 13)
The compensation capacitor (Cc1) and the output resistor
of error amplifier RGM creates another pole of the system,
and it’s located at:
f
p2
+
1
2p C
C1
R
GM
,
(eq. 14)
Where R
GM
= 66 10
3
W.
In this compensation scheme, the pole created by CC2 is
used to cancel out the zero created by the ESR of the output
capacitor. This pole is located at:
f
p3
+
1
2p @ C
C2
@
R
C
R
GM
R
C
)R
GM
,
(eq. 15)
For the typical case, use CC2 if:
f
ESR
t
f
S
2
(eq. 16)
C
C2
+
R
GM
) R
C
2p f
ESR
R
GM
R
C
(eq. 17)
A feedforward capacitor is recommended for most
designs. The large resistor value and the parasitic
capacitance of the FB Pin can cause a high frequency pole
that can reduce the overall system phase margin. By placing
a feedforward capacitor C
FF
, these effects can be
significantly reduced. C
FF
will provide a positive phase shift
(lead) that can be used to increase phase margin. However,
it is important to note that the effectiveness of C
FF
decreases
with output voltage. This is due to the fact that the frequency
of the zero f
zff
and pole f
pff
get closer together as the output
voltage is reduced.
The frequency of the feedforward zero and pole are:
f
Zff
+
1
2p R
FB1
C
ff
(eq. 18)
f
pff
+
1
2p R
FB1
C
ff
R
FB1
) R
FB2
R
FB2
+ f
Zff
V
out
V
FB
(eq. 19)
Power Dissipation
The NCP1599 is available in thermally enhanced 6pin,
DFN package. When the die temperature reaches +185°C,
the NCP1599 shuts down (see the ThermalOverload
Protection section). The power dissipated in the device is the
sum of the power dissipated from supply current (PQ),
power dissipated due to switching the internal power
MOSFET (P
SW
), and the power dissipated due to the RMS
current through the internal power MOSFET (PON). The
total power dissipated in the package must be limited so the
junction temperature does not exceed its absolute maximum
rating of +150°C at maximum ambient temperature.
Calculate the power lost in the NCP1599 using the following
equations:
1. High side MOSFET
The conduction loss in the top switch is:
P
HSON
+ I
2
RMS_HSFET
R
DS(on)HS
(eq. 20)
Where:
I
RMS_FET
+
ǒ
I
out
2
)
DI
PP
2
12
Ǔ
D
Ǹ
(eq. 21)
DI
PP
is the peaktopeak inductor current ripple.
The power lost due to switching the internal power high side
MOSFET is:
P
HSSW
+
V
in
@ I
out
@
ǒ
t
r
) t
f
Ǔ
@ f
SW
2
(eq. 22)
t
r
and t
f
are the rise and fall times of the internal power
MOSFET measured at SW node.
NCP1599
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14
2. Low side MOSFET
The power dissipated in the top switch is:
P
LSON
+ I
RMS_LSFET
2
@ R
DS(on)LS
(eq. 23)
Where:
I
RMS_LSFET
+
ǒ
I
out
2
)
DI
PP
2
12
Ǔ
@
(
1 * D
)
Ǹ
(eq. 24)
DI
PP
is the peaktopeak inductor current ripple.
The switching loss for the low side MOSFET can be
ignored.
The power lost due to the quiescent current (IQ) of the device
is:
P
Q
+ V
in
@ I
Q
(eq. 25)
IQ is the switching quiescent current of the NCP1599.
P
TOTAL
+ P
HSON
) P
HSSW
) P
LSON
) P
Q
(eq. 26)
Calculate the temperature rise of the die using the following
equation:
T
J
+ T
C
)
ǒ
P
TOTAL
@ q
JC
Ǔ
(eq. 27)
q
JC
is the junctiontocase thermal resistance equal to
1.7°C/W. T
C
is the temperature of the case and T
J
is the
junction temperature, or die temperature. The caseto
ambient thermal resistance is dependent on how well heat
can be transferred from the PC board to the air. Solder the
undersideexposed pad to a large copper GND plane. If the
die temperature reaches the thermal shutdown threshold the
NCP1599 shuts down and does not restart again until the die
temperature cools by 30°C.
Layout
As with all high frequency switchers, when considering
layout, care must be taken in order to achieve optimal
electrical, thermal and noise performance. To prevent noise
both radiated and conducted, the high speed switching
current path must be kept as short as possible. Shortening the
current path will also reduce the parasitic trace inductance
of approximately 25 nH/inch. At switch off, this parasitic
inductance produces a flyback spike across the NCP1599
switch. When operating at higher currents and input
voltages, with poor layout, this spike can generate voltages
across the NCP1599 that may exceed its absolute maximum
rating. A ground plane should always be used under the
switcher circuitry to prevent interplane coupling and overall
noise.
The COMP and FB components should be kept as far
away as possible from the switch node. The ground for these
components should be separated from the switch current
path. Failure to do so will result in poor stability or
subharmonic like oscillation.
Board layout also has a significant effect on thermal
resistance. Reducing the thermal resistance from the ground
pin and exposed pad onto the board will reduce die
temperature and increase the power capability of the
NCP1599. This is achieved by providing as much copper
area as possible around the exposed pad. Adding multiple
thermal vias under and around this pad to an internal ground
plane will also help. Similar treatment to the inductor pads
will reduce any additional heating effects.
Derating
The following graph shows the maximum output current
of the NCP1599 with a typical 4layer PCB layout vs input
voltage (V
in
) and output current (I
out
). The maximum
allowable current is 3 A. The maximum junction
temperature (T
J
) of the device, so the ”thermal limit” shows
when maximum T
J
is reached. The maximum duty cycle of
the NCP1599 is also shown. The PCB used for this data is
the standard evaluation board (NCP1599GEVB) and is
available at www.onsemi.com.
Figure 27. Derating Curves
2.0
2.1
2.2
2.3
2.4
2.5
2.6
MAXIMUM OUTPUT CURRENT (A)
V
OUT
, OUTPUT VOLTAGE (V)
2.7
2.8
2.9
3.0
1.1 2.9 3.80.8 1.4 1.7 2.0 2.3 2.6 3.2 3.5 4.1 4.4
V
IN
= 3.3 V
V
IN
= 5.0 V
3.1
3.2
Maximum Duty Cycle
Maximum Duty Cycle
Maximum
Current
Thermal
Limit
Thermal
Limit
NCP1599
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15
PACKAGE DIMENSIONS
DFN6 3x3, 0.95P
CASE 506AH
ISSUE O
SCALE 2:1
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
PIN 1
REFERENCE
A
B
C0.15
2X
2X
TOP VIEW
D
E
C0.15
NOTES:
1. DIMENSIONS AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMESNION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND 0.30
MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
3.31
0.130
0.63
0.025
2.60
0.1023
0.450
0.0177
1.700
0.685
ǒ
mm
inches
Ǔ
SCALE 10:1
0.950
0.0374
E2
BOTTOM VIEW
b
0.10
6X
L
13
0.05
C AB
C
D2
4X
e
K
64
6X
6X
(A3)
C
C0.08
6X
C0.10
SIDE VIEW
A1
A
SEATING
PLANE
DIM MIN NOM MAX
MILLIMETERS
A 0.80 0.90 1.00
A1 0.00 0.03 0.05
A3 0.20 REF
b 0.35 0.40 0.45
D 3.00 BSC
D2 2.40 2.50 2.60
E 3.00 BSC
E2 1.50 1.60 1.70
e 0.95 BSC
K 0.21 −−− −−−
L 0.30 0.40 0.50
(NOTE 3)
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
NCP1599/D
PUBLICATION ORDERING INFORMATION
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For additional information, please contact your local
Sales Representative

NCP1599GEVB

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Power Management IC Development Tools NCP1599 EVB
Lifecycle:
New from this manufacturer.
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