NCP1589L
http://onsemi.com
8
PACKAGE DIMENSIONS
DFN10, 3x3, 0.5P
CASE 485C
ISSUE C
10X
SEATING
PLANE
L
D
E
0.15 C
A
A1
e
D2
E2
b
15
10 6
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
5. TERMINAL b MAY HAVE MOLD COMPOUND
MATERIAL ALONG SIDE EDGE. MOLD
FLASHING MAY NOT EXCEED 30 MICRONS
ONTO BOTTOM SURFACE OF TERMINAL b.
6. DETAILS A AND B SHOW OPTIONAL VIEWS
FOR END OF TERMINAL LEAD AT EDGE OF
PACKAGE.
7. FOR DEVICE OPN CONTAINING W OPTION,
DETAIL B ALTERNATE CONSTRUCTION IS
NOT APPLICABLE.
B
A
0.15
C
TOP VIEW
SIDE VIEW
BOTTOM VIEW
PIN 1
REFERENCE
0.10 C
0.08 C
(A3)
C
10X
10X
0.10 C
0.05
C
A B
NOTE 3
K
10X
DIM MIN MAX
MILLIMETERS
A 0.80 1.00
A1 0.00 0.05
A3 0.20 REF
b 0.18 0.30
D 3.00 BSC
D2 2.40 2.60
E 3.00 BSC
E2 1.70 1.90
e 0.50 BSC
L 0.35 0.45
L1 0.00 0.03
DETAIL A
K 0.19 TYP
2X
2X
L1
DETAIL A
Bottom View
(Optional)
A1
A3
DETAIL B
Side View
(Optional)
EDGE OF PACKAGE
MOLD CMPD
EXPOSED Cu
DETAIL B
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
2.1746
2.6016
1.8508
0.5000 PITCH
0.5651
10X
3.3048
0.3008
10X
DIMENSIONS: MILLIMETERS
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NCP1589L/D
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