ADMV1010 Data Sheet
Rev. B | Page 16 of 21
THEORY OF OPERATION
The ADMV1010 is a compact GaAs, MMIC, single sideband
(SSB) downconverter in a RoHS compliant package optimized
for upper sideband point to point microwave radio applications
operating in the 12.6 GHz to 15.4 GHz input frequency range.
The ADMV1010 supports LO input frequencies of 9 GHz to
12.6 GHz and IF output frequencies of 2.7 GHz to 3.5 GHz.
The ADMV1010 uses a RF LNA amplifier followed by an I/Q
double balanced mixer, where a driver amplifier drives the LO
(see Figure 1). The combination of design, process, and pack-
aging technology allows the functions of these subsystems to be
integrated into a single die, using mature packaging and inter-
connection technologies to provide a high performance, low
cost design with excellent electrical, mechanical, and thermal
properties. In addition, the need for external components is
minimized, optimizing cost and size.
LO DRIVER AMPLIFIER
The LO driver amplifier takes a single LO input and amplifies it
to the desired LO signal level for the mixer to operate optimally.
The LO driver amplifier is self biased, and it only requires a
single dc bias voltage (VDLO) to operate. The bias current for
the LO amplifier is 100 mA at 4 V typically. The LO drive range
of −4 dBm to +4 dBm makes it compatible with Analog Devices,
Inc., wideband synthesizer portfolio without the need for an
external LO driver amplifier.
MIXER
The mixer is an I/Q double balanced mixer, and this mixer
topology reduces the need for filtering the unwanted sideband.
An external 90° hybrid is required to select the upper sideband
of operation. The ADMV1010 has been optimized to work with
the Mini-Circuits QCN-45+ RF 90° hybrid.
LNA
The LNA is self biased, and it requires only a single dc bias
voltage (VDRF) to operate. The bias current for the LNA is
60 mA at 4 V typically.
The application circuit (see Figure 47) provided shows the
necessary external components on the bias lines to eliminate
any undesired stability problems for the RF amplifier and the
LO amplifier.
The ADMV1010 is a much smaller alternative to hybrid style
image reject converter assemblies, and it eliminates the need for
wire bonding by allowing the use of surface-mount manufacturing
assemblies.
The ADMV1010 downconverter comes in a compact, thermally
enhanced, 4.9 mm × 4.9 mm, 32-terminal ceramic leadless chip
carrier (LCC) package. The ADMV1010 operates over the
40°C to +85°C temperature range.
Data Sheet ADMV1010
Rev. B | Page 17 of 21
APPLICATIONS INFORMATION
The evaluation board and typical application circuit are
optimized for low-side LO (upper sideband) performance with
the Mini-Circuit QCN-45+ RF 90° hybrid. Because the I/Q
mixers are double balanced, the ADMV1010 can support IF
frequencies from 3.5 GHz to low frequency.
TYPICAL APPLICATION CIRCUIT
The typical applications circuit is shown in Figure 47. The
application circuit shown here has been replicated for the
evaluation board circuit.
13/15 DC
ADMV1010AEZ
0.01µF
QCN-45+
50Ω
1µF
0.01µF
1µF
100pF
100pF
DUT
IF_OUTPUT
LO_INPUT
RF_INPUT
VDLNA
VDLO
X1
C7
C8
C9
R3
C3
C2
C1
LO_INPUT
RF_INPUT
IF_OUTPUT
VDLNA
VDLO
14
28
3
32
31
30
29
27
26
25
24
17
16
15
13
12
8
7
6
5
1
10
22
19
23
21
20
18
11
9
4
2
PAD
4 3 2
1
1
1
1
1
1 6
4 3
PAD
NIC
NIC
NIC
NIC
VDRF
NIC
NIC
NIC
NIC
NIC
IF2
GND
GND
IF1
GND
NIC
NIC
NIC
VDLO
NIC
NIC
GND
LO_IN
NIC
NIC
NIC
NIC
NIC
GND
RFIN
GND
NIC
AGND
AGND
AGND
AGND
AGND
AGND
PORT_1
PORT_2
GND
50_OHM_TERM
GND
SUM_PORT
AGND
AGND
AGND
15788-147
5 2
4 3 2
4 3 2
Figure 47. Typical Application Circuit
ADMV1010 Data Sheet
Rev. B | Page 18 of 21
EVALUATION BOARD
The circuit board used in the application must use RF circuit
design techniques. Signal lines must have 50 Ω impedance, and
the package ground leads and exposed pad must be connected
directly to the ground plane similarly to that shown in Figure 48
and Figure 49. Use a sufficient number of via holes to connect
the top and bottom ground planes. The evaluation circuit board
shown in Figure 50 is available from Analog Devices upon
request.
Layout
Solder the exposed pad on the underside of the ADMV1010 to
a low thermal and electrical impedance ground plane. This pad
is typically soldered to an exposed opening in the solder mask
on the evaluation board. Connect these ground vias to all other
ground layers on the evaluation board to maximize heat dissi-
pation from the device package. Figure 48 shows the printed
circuit board (PCB) land pattern footprint for the ADMV1010-
EVA LZ , and Figure 49 shows the solder paste stencil for the
ADMV1010-E VA LZ .
0.138" SQUARE MASK OPENING
0.02 × 45° CHAMFER FOR PIN 1
0.197"
[0.50]
PAD SIZE
0.026" × 0.010"
0.217" SQUARE
0.004" MASK/METAL OVERLAP
0.010" MINIMUM MASK WIDTH
0.010" REF
0.030"
MASK OPENING
0.156"
MASK
OPENING
PIN 1
GROUND PAD
SOLDER MASK
0.146" SQUARE
GROUND PAD
ø.010"
TYPICAL VIA
ø.034"
TYPICAL
VIA SPACING
15788-148
Figure 48. PCB Land Pattern Footprint of the ADMV1010-EVALZ

ADMV1010AEZ-R7

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Up-Down Converters 13/15GHz GaAs D/C
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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