ADMV1010 Data Sheet
Rev. B | Page 4 of 21
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
Supply Voltage
VDRF 5.5 V
VDLO 5.5 V
RF Input Power 15 dBm
LO Input Power 15 dBm
Maximum Junction Temperature (T
J
) 175°C
Maximum Power Dissipation 1.7 W
Lifetime at Maximum Junction Temperature
Operating Temperature Range −40°C to +85°C
Storage Temperature Range −65°C to +150°C
Lead Temperature Range (Soldering, 60 sec) 260°C
Moisture Sensitivity Level (MSL) Rating MSL3
Electrostatic Discharge (ESD) Sensitivity
Human Body Model (HBM) 250 V
Field Induced Charged Device Model (FICDM) 500 V
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to
PCB thermal design is required.
θ
JA
is thermal resistance, junction to ambient (°C/W), and θ
JC
is
thermal resistance, junction to case (°C/W).
Table 3.
Package Type θ
JA
1
θ
JC
1
Unit
1
See JEDEC standard JESD51-2 for additional information on optimizing the
thermal impedance (PCB with 3 × 3 vias).
ESD CAUTION
