IRLML2402TRPBF

Fifth Generation HEXFETs from International Rectifier
utilize advanced processing techniques to achieve
extremely low on-resistance per silicon area. This benefit,
combined with the fast switching speed and ruggedized
device design that HEXFET Power MOSFETs are well
known for, provides the designer with an extremely efficient
and reliable device for use in a wide variety of applications.
A customized leadframe has been incorporated into the
standard SOT-23 package to produce a HEXFET Power
MOSFET with the industry's smallest footprint. This
package, dubbed the Micro3, is ideal for applications
where printed circuit board space is at a premium. The low
profile (<1.1mm) of the Micro3 allows it to fit easily into
extremely thin application environments such as portable
electronics and PCMCIA cards.
V
DSS
= 20V
R
DS(on)
= 0.25Ω
HEXFET
®
Power MOSFET
Description
l Generation V Technology
l Ultra Low On-Resistance
l N-Channel MOSFET
l SOT-23 Footprint
l Low Profile (<1.1mm)
l Available in Tape and Reel
l Fast Switching
l Lead-Free
l RoHS Compliant, Halogen-Free
Parameter Max. Units
I
D
@ T
A
= 25°C Continuous Drain Current, V
GS
@ 4.5V 1.2
I
D
@ T
A
= 70°C Continuous Drain Current, V
GS
@ 4.5V 0.95 A
I
DM
Pulsed Drain Current 7.4
P
D
@T
A
= 25°C Power Dissipation 540 mW
Linear Derating Factor 4.3 mW/°C
V
GS
Gate-to-Source Voltage ± 12 V
dv/dt Peak Diode Recovery dv/dt 5.0 V/ns
T
J,
T
STG
Junction and Storage Temperature Range -55 to + 150 °C
Absolute Maximum Ratings
Parameter Typ. Max. Units
R
θJA
Maximum Junction-to-Ambient  230
Thermal Resistance
°C/W
D
S
G
3
1
2
Micro3
IRLML2402PbF
Form Quantity
IRLML2402TRPbF Micro3
(SOT-23) Tape and Reel 3000 IRLML2402TRPbF
Package Type
Standard Pack
Orderable Part NumberBase Part Number
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IRLML2402PbF
Parameter Min. Typ. Max. Units Conditions
V
(BR)DSS
Drain-to-Source Breakdown Voltage 20   V V
GS
= 0V, I
D
= 250µA
ΔV
(BR)DSS
/ΔT
J
Breakdown Voltage Temp. Coefficient  0.024  VC Reference to 25°C, I
D
= 1mA
  0.25 V
GS
= 4.5V, I
D
= 0.93A
  0.35 V
GS
= 2.7V, I
D
= 0.47A
V
GS(th)
Gate Threshold Voltage 0.70   V V
DS
= V
GS
, I
D
= 250µA
g
fs
Forward Transconductance 1.3   S V
DS
= 10V, I
D
= 0.47A
  1.0 V
DS
= 16V, V
GS
= 0V
  25 V
DS
= 16V, V
GS
= 0V, T
J
= 125°C
Gate-to-Source Forward Leakage   -100 V
GS
= -12V
Gate-to-Source Reverse Leakage   100 V
GS
= 12V
Q
g
Total Gate Charge  2.6 3.9 I
D
= 0.93A
Q
gs
Gate-to-Source Charge  0.41 0.62 nC V
DS
= 16V
Q
gd
Gate-to-Drain ("Miller") Charge  1.1 1.7 V
GS
= 4.5V, See Fig. 6 and 9
t
d(on)
Turn-On Delay Time  2.5  V
DD
= 10V
t
r
Rise Time  9.5  I
D
= 0.93A
t
d(off)
Turn-Off Delay Time  9.7  R
G
= 6.2Ω
t
f
Fall Time  4.8  R
D
= 11Ω, See Fig. 10
C
iss
Input Capacitance  110  V
GS
= 0V
C
oss
Output Capacitance  51  pF V
DS
= 15V
C
rss
Reverse Transfer Capacitance  25  = 1.0MHz, See Fig. 5
Ω
µA
nA
ns
I
GSS
I
DSS
Drain-to-Source Leakage Current
R
DS(on)
Static Drain-to-Source On-Resistance
Electrical Characteristics @ T
J
= 25°C (unless otherwise specified)
Parameter Min. Typ. Max. Units Conditions
I
S
Continuous Source Current MOSFET symbol
(Body Diode) showing the
I
SM
Pulsed Source Current integral reverse
(Body Diode) p-n junction diode.
V
SD
Diode Forward Voltage   1.2 V T
J
= 25°C, I
S
= 0.93A, V
GS
= 0V
t
rr
Reverse Recovery Time  25 38 ns T
J
= 25°C, I
F
= 0.93A
Q
rr
Reverse RecoveryCharge  16 24 nC di/dt = 100A/µs
Source-Drain Ratings and Characteristics
A
  7.4
  0.54
S
D
G
Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11 )
I
SD
0.93A, di/dt 90A/µs, V
DD
V
(BR)DSS
,
T
J
150°C
Notes:
Pulse width 300µs; duty cycle 2%.
Surface mounted on FR-4 board, t 5sec.
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IRLML2402PbF
Fig 4. Normalized On-Resistance
Vs. Temperature
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
Fig 3. Typical Transfer Characteristics
0.01
0.1
1
10
100
0.1 1 10
I , Drain-to-Source Current (A)
D
V , Drain-to-Source Voltage (V)
DS
20μs PULSE WIDTH
T = 25°C
A
VGS
TOP 7.5V
5.0V
4.0V
3.5V
3.0V
2.5V
2.0V
BOTTOM 1.5V
1.5V
J
0.01
0.1
1
10
100
0.1 1 10
I , Drain-to-Source Current (A)
D
V , Drain-to-Source Voltage (V)
DS
A
VGS
TOP 7.5V
5.0V
4.0V
3.5V
3.0V
2.5V
2.0V
BOTTOM 1.5V
1.5V
20μs PULSE WIDTH
T = 150°C
J
0.01
0.1
1
10
1.5 2.0 2.5 3.0 3.5 4.0
T = 25°C
T = 150°C
J
J
GS
V , Gate-to-Source Voltage (V)
D
I , Drain-to-Source Current (A)
A
V = 10V
20μs PULSE WIDTH
DS
0.0
0.5
1.0
1.5
2.0
-60 -40 -20 0 20 40 60 80 100 120 140 160
J
T , Junction Temperature (°C)
R , Drain-to-Source On Resistance
DS(on)
(Normalized)
A
V = 4.5V
GS
I = 0.93A
D

IRLML2402TRPBF

Mfr. #:
Manufacturer:
Infineon / IR
Description:
MOSFET MOSFT 20V 1.2A 250mOhm 2.6nC LogLvl
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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