5
PS8704C 11/13/08
PI49FCT32802
PI49FCT32803
1:5/1:7 3.3V CMOS Clock Drivers
.189
.197
.053
.069
.004
.010
SEATING
PLANE
.025
BSC
.007
.010
.228
.244
1
16
.150
.157
X.XX
X.XX
DENOTES DIMENSIONS IN MILLIMETERS
0.635
4.80
5.00
1.35
1.75
5.79
6.19
0.101
0.254
.008
.012
0.203
0.305
3.81
3.99
0.178
0.254
0.38
.008
0.203
.015 x 45°
REF
Detail A
Detail A
.008
0.20
MIN.
Guage Plane
.010
0.254
.041
1.04
REF
.016
.035
0.41
0.89
0˚-6˚
.008
.013
0.20
0.33
DESCRIPTION: 16-Pin 150-Mil Wide QSOP
PACKAGE CODE: Q
DOCUMENT CONTROL NO.
PD - 1201
REVISION: G
DATE: 11/07/07
Note:
1) Controlling dimensions in inches.
2) Ref: JEDEC MO-137B/AB.
3) Dimensions do not include mold flash, protrusions or gate burrs
Pericom Semiconductor Corporation
3545 N. 1st Street, San Jose, CA 95134
1-800-435-2335 • www.pericom.com
DESCRIPTION: 16-Pin, 173-Mil Wide, TSSOP
PACKAGE CODE: L
DOCUMENT CONTROL NO.
PD - 1310
REVISION: E
DATE: 03/09/05
Note:
1. Package Outline Exclusive of Mold Flash and Metal Burr
2. Controlling dimentions in millimeters
3. Ref: JEDEC MO-153F/AB
Pericom Semiconductor Corporation
3545 N. 1st Street, San Jose, CA 95134
1-800-435-2335 • www.pericom.com
.193
.201
.047
max.
.002
.006
SEATING
PLANE
.0256
BSC
.018
.030
.004
.008
.252
BSC
1
16
.169
.177
0.05
0.15
6.4
0.45
0.75
0.09
0.20
4.3
4.5
1.20
4.9
5.1
0.65
0.19
0.30
.007
.012
Packaging Mechanical: 16-pin TSSOP (L)
Packaging Mechanical: 16-pin QSOP (Q)