APT5010JVRU3

APT5010JVRU3
APT5010JVRU3 – Rev 2 October, 2012
www.microsemi.com
1
8
ISOTOP
Absolute maximum ratings
These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.
A
S
G
D
Symbol Parameter Max ratings Unit
V
DSS
Drain - Source Breakdown Voltage 500 V
T
c
= 25°C 44
I
D
Continuous Drain Current
T
c
= 80°C 33
I
DM
Pulsed Drain current 176
A
V
GS
Gate - Source Voltage ±30 V
R
DSon
Drain - Source ON Resistance 100
m
P
D
Maximum Power Dissipation T
c
= 25°C 450 W
I
AR
Avalanche current (repetitive and non repetitive) 44 A
E
AR
Repetitive Avalanche Energy 50
E
AS
Single Pulse Avalanche Energy 2500
mJ
IF
AV
Maximum Average Forward Current Duty cycle=0.5 Tc = 80°C 30
IF
RMS
RMS Forward Current (Square wave, 50% duty) 39
A
V
DSS
= 500V
R
DSon
= 100m max @ Tj = 25°C
I
D
= 44A @ Tc = 25°C
Application
AC and DC motor control
Switched Mode Power Supplies
Features
Power MOS V
®
MOSFETs
- Low R
DSon
- Low input and Miller capacitance
- Low gate charge
- Fast intrinsic diode
- Avalanche energy rated
- Very rugged
ISOTOP
®
Package (SOT-227)
Very low stray inductance
High level of integration
Benefits
Outstanding performance at high frequency operation
Direct mounting to heatsink (isolated package)
Low junction to case thermal resistance
Very rugged
Low profile
RoHS Compliant
ISOTOP
®
Buck chopper
MOSFET Power Module
A
D
G
S
APT5010JVRU3
APT5010JVRU3 – Rev 2 October, 2012
www.microsemi.com
2
8
All ratings @ T
j
= 25°C unless otherwise specified
Electrical Characteristics
Symbol Characteristic Test Conditions Min Typ Max Unit
V
GS
= 0V,V
DS
= 500V
T
j
= 25°C 25
I
DSS
Zero Gate Voltage Drain Current
V
GS
= 0V,V
DS
= 400V
T
j
= 125°C 250
µA
R
DS(on)
Drain – Source on Resistance
V
GS
= 10V, I
D
= 22A 100
m
V
GS(th)
Gate Threshold Voltage V
GS
= V
DS
, I
D
= 2.5mA 2 4 V
I
GSS
Gate – Source Leakage Current V
GS
= ±20 V, V
DS
= 0V ±100 nA
Dynamic Characteristics
Symbol Characteristic Test Conditions Min Typ Max Unit
C
iss
Input Capacitance 7410
C
oss
Output Capacitance 1050
C
rss
Reverse Transfer Capacitance
V
GS
= 0V
V
DS
= 25V
f = 1MHz
390
pF
Q
g
Total gate Charge 312
Q
gs
Gate – Source Charge 37
Q
gd
Gate – Drain Charge
V
GS
= 10V
V
Bus
= 250V
I
D
= 44A @ T
J
=25°C
127
nC
T
d(on)
Turn-on Delay Time 18
T
r
Rise Time 16
T
d(off)
Turn-off Delay Time 54
T
f
Fall Time
V
GS
= 15V
V
Bus
= 250V
I
D
= 44A @ T
J
=25°C
R
G
= 0.6
5
ns
Chopper diode ratings and characteristics
Symbol Characteristic Test Conditions Min Typ Max Unit
I
F
= 30A 1.6 1.8
I
F
= 60A 1.9
V
F
Diode Forward Voltage
I
F
= 30A T
j
= 125°C 1.4
V
V
R
= 600V T
j
= 25°C 250
I
RM
Maximum Reverse Leakage Current
V
R
= 600V T
j
= 125°C 500
µA
C
T
Junction Capacitance V
R
= 200V 44 pF
Reverse Recovery Time
I
F
=1A,V
R
=30V
di/dt =100A/µs
T
j
= 25°C 23
T
j
= 25°C 85
t
rr
Reverse Recovery Time
T
j
= 125°C 160
ns
T
j
= 25°C 4
I
RRM
Maximum Reverse Recovery Current
T
j
= 125°C 8
A
T
j
= 25°C 130
Q
rr
Reverse Recovery Charge
I
F
= 30A
V
R
= 400V
di/dt =200A/µs
T
j
= 125°C 700
nC
t
rr
Reverse Recovery Time 70 ns
Q
rr
Reverse Recovery Charge 1300 nC
I
RRM
Maximum Reverse Recovery Current
I
F
= 30A
V
R
= 400V
di/dt =1000A/µs
T
j
= 125°C
30 A
APT5010JVRU3
APT5010JVRU3 – Rev 2 October, 2012
www.microsemi.com
3
8
Thermal and package characteristics
Symbol Characteristic Min Typ Max Unit
MOSFET 0.28
R
thJC
Junction to Case Thermal Resistance
Diode 1.21
R
thJA
Junction to Ambient (IGBT & Diode) 20
°C/W
V
ISOL
RMS Isolation Voltage, any terminal to case t =1 min, 50/60Hz
2500 V
T
J
,T
STG
Storage Temperature Range -55 150
T
L
Max Lead Temp for Soldering:0.063” from case for 10 sec 300
°C
Torque Mounting torque (Mounting = 8-32 or 4mm Machine and terminals = 4mm Machine) 1.5 N.m
Wt Package Weight 29.2 g
Typical MOSFET Performance Curve

APT5010JVRU3

Mfr. #:
Manufacturer:
Microchip / Microsemi
Description:
Discrete Semiconductor Modules Power Module - Mosfet
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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