IXFN64N50PD2

© 2006 IXYS All rights reserved
Symbol Test Conditions Maximum Ratings
V
DSS
T
J
= 25° C to 150° C 500 V
V
DGR
T
J
= 25° C to 150° C; R
GS
= 1 M 500 V
V
GS
Continuous ± 30 V
V
GSM
Transient ± 40 V
I
D25
T
C
= 25° C52A
I
DM
T
C
= 25° C, pulse width limited by T
JM
200 A
I
AR
T
C
= 25° C36A
E
AR
T
C
= 25° C50mJ
E
AS
T
C
= 25° C 1.5 J
dv/dt I
S
I
DM
, di/dt 100 A/µs, V
DD
V
DSS
, 10 V/ns
T
J
150° C, R
G
= 2
P
D
T
C
= 25° C 625 W
T
J
-55 ... +150 °C
T
JM
150 °C
T
stg
-55 ... +150 °C
M
D
Mounting Ttorque 1.5 / 13 Nm/lb-in
Terminal connection torque 5 / 13 Nm/lb-in
Weight 30 g
Symbol Test Conditions Characteristic Values
(T
J
= 25° C unless otherwise specified) Min. Typ. Max.
BV
DSS
V
GS
= 0 V, I
D
= 500 µA 500 V
V
GS(th)
V
DS
= V
GS
, I
D
= 8 mA 3.0 5.0 V
I
GSS
V
GS
= ± 30 V, V
DS
= 0 ± 200 nA
I
DSS
V
DS
= V
DSS
50 µA
V
GS
= 0 V T
J
= 125° C1mA
R
DS(on)
V
GS
= 10 V, I
D
= 32 A, Note 1 85 m
PolarHV
TM
HiPerFET
Power MOSFET
Boost Configuration for
PFC Circuits
N-Channel Enhancement Mode
Avalanche Rated
Fast Intrinsic Diode
IXFN 64N50PD2
V
DSS
= 500 V
I
D25
=52 A
R
DS(on)
85 m
t
rr
200 ns
DS99507E(05/06)
2
1
4
3
Features
l
Fast intrinsic diode in boost
configuration
International standard package
Encapsulating epoxy meets
UL 94 V-0, flammability classification
miniBLOC with Aluminium nitride
isolation
l
Unclamped Inductive Switching (UIS)
rated
l
Low package inductance
- easy to drive and to protect
Advantages
l
Easy to mount
l
Space savings
l
Tightly coupled FRED diode
l
High power density
2
3
1
4
miniBLOC, SOT-227 B (IXFN)
E153432
1 = Source 3 = Drain / Diode anode
2 = Gate 4 = Diode / Diode cathode
Preliminary Technical Information
IXYS reserves the right to change limits, test conditions, and dimensions.
IXFN 64N50PD2
IXYS MOSFETs and IGBTs are covered by 4,835,592 4,931,844 5,049,961 5,237,481 6,162,665 6,404,065 B1 6,683,344 6,727,585
one or more of the following U.S. patents: 4,850,072 5,017,508 5,063,307 5,381,025 6,259,123 B1 6,534,343 6,710,405B2 6,759,692
4,881,106 5,034,796 5,187,117 5,486,715 6,306,728 B1 6,583,505 6,710,463 6771478 B2
Symbol Test Conditions Characteristic Values
(T
J
= 25° C unless otherwise specified)
Min. Typ. Max.
g
fs
V
DS
= 20 V; I
D
= 32 A, Note 1 65 72 S
C
iss
11 nF
C
oss
V
GS
= 0 V, V
DS
= 25 V, f = 1 MHz 1020 pF
C
rss
80 pF
t
d(on)
28 ns
t
r
V
GS
= 10 V, V
DS
= 0.5 V
DSS
, I
D
= 64 A 32 ns
t
d(off)
R
G
= 2 (External) 110 ns
t
f
30 ns
Q
g(on)
186 nC
Q
gs
V
GS
= 10 V, V
DS
= 0.5 V
DSS
, I
D
= 32 A 60 nC
Q
gd
62 nC
R
thJC
0.2 ° C/W
R
thCS
0.05 ° C/W
Source-Drain Diode Characteristic Values
T
J
= 25° C unless otherwise specified)
Symbol Test Conditions Min. Typ. Max.
I
S
V
GS
= 0 V 64 A
I
SM
Repetitive 200 A
V
SD
I
F
= I
S
, V
GS
= 0 V, Note 1 1.5 V
t
rr
I
F
= 25 A, -di/dt = 100 A/µs 200 ns
Q
RM
V
R
= 100 V, V
GS
= 0 V 0.8 µC
I
RM
8A
Note 1: Pulse test, t 300 µs, duty cycle d 2 %
(M4 screws (4x) supplied)
SOT-227B (IXFN) Outline
PRELIMINARY TECHNICAL INFORMATION
The product presented herein is under development. The Technical Specifications
offered are derived from data gathered during objective characterizations of preliminary
engineering lots; but also may yet contain some information supplied during a pre-
production design evaluation. IXYS reserves the right to change limits, test conditions,
and dimensions without notice.

IXFN64N50PD2

Mfr. #:
Manufacturer:
Littelfuse
Description:
Discrete Semiconductor Modules 64 Amps 500V
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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