MIC2128 Evaluation Board User’s Guide
DS50002533A-page 28 2016 Microchip Technology Inc.
TABLE B-2: BILL OF MATERIALS (BOM) - MECHANICAL PARTS
Qty. Reference Description Manufacturer Part Number
0 D2 100V Schottky diode, power PAK S08
(5.15 mm X 6.15 mm)
DO NOT POPULATE
2 JU1, JU3 2-pin Header (100 mil pitch) TE Connectivity, Ltd. 5-146278-2
1 JU2 3-pin Header (100 mil pitch) TE Connectivity, Ltd. 5-146282-3
9 PG, AGND, VDD, EN,
EXTVDD, VIN, PGND,
VOUT, PGND
Terminal double turret
(through hole, noninsulated)
Keystone
Electronics Corp.
1593-2
1 L1 10 µH inductor,
size 13.5 mm X 12.5 mm X 6.2 mm
Bourns
®
, Inc. SRP1265A-100M
2 Q1, Q4 N-Channel MOSFET, power PAK S08
(5.15 mm X 6.15 mm)
DO NOT POPULATE
2 Q2, Q3 100V,40A N-Channel MOSFET, power PAK
S08 (5.15 mm X 6.15 mm)
Vishay
Intertechnology, Inc.
SIR878ADP
4 VIN, PGND, VOUT,
PGND
Noninsulated banana jack Keystone
Electronics Corp.
575-4
2 Shunt Shunts with closed top,
(100 mil pitch)
Sullins Connector
Solutions
SPC02SYAN
Note 1: The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM used in
manufacturing uses all RoHS-compliant components.