3
Electronic Solutions Division
Interconnect Solutions
http://www.3Mconnectors.com
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3M
™
MetPak
™
2-FB Socket
2 mm 4/5-Row, Solder Tail or Press-Fit With Tail Cover, Right Angle MP2 Series
TS-1115-D
Sheet 3 of 4
Table 1 - Connector & Row Lengths
Pin
Count
Dim “A”
mm (Inch)
Dim “B”
mm (Inch)
Rows
Block
Count
024 11.95 [0.471] 10.00 [0.394] 4 1
048 23.95 [0.943] 22.00 [0.866] 4 2
072 35.95 [1.415] 34.00 [1.339] 4 3
096 47.95 [1.889] 46.00 [1.811] 4 4
120 59.95 [2.36] 58.00 [2.283] 4 5
144 71.95 [2.833] 70.00 [2.756] 4 6
168 83.95 [3.305] 82.00 [3.228] 4 7
192 95.95 [3.778] 94.00 [3.701] 4 8
030 11.95 [0.471] 10.00 [0.394] 5 1
060 23.95 [0.943] 22.00 [0.866] 5 2
090 35.95 [1.415] 34.00 [1.339] 5 3
120 47.95 [1.888] 46.00 [1.811] 5 4
150 59.95 [2.361] 58.00 [2.283] 5 5
180 71.95 [2.833] 70.00 [2.756] 5 6
210 83.95 [3.305] 82.00 [3.228] 5 7
240 95.95 [3.778] 94.00 [3.701] 5 8
Table 2 - Tail & Post Lengths
Contact-to-PC
Board Tail Termina-
tion Option No.
Dim “C” Dim. “D”
Solder Press-Fit*
M1 2.72 [0.107] 3.57 [0.141]
M2 P1 3.53 [0.139] 3.57 [0.141]
*Compliant-Pin Tail
Table 3 - Plating
Plating Suffix Press-Fit Tails* Solder Tails Plating Composition
KR (RIA E1 & C1 apply) (RIA E1 & C1 apply) 0.76 μm [30 μ”] Min. Au Contact Area
2.54 μm [100 μ”] Min. Matt Whisker Mitigating Sn Tail Area
1.27 μm [50 μ”] Min. Ni all over
LR (RIA E1 & C1 apply) (RIA E1 & C1 apply) 0.08 μm [3 μ”] Min. Au Contact Area
0.67 μm [27 μ”] Min. PdNi Contact Area
2.54 μm [100 μ”] Min. Matt Whisker Mitigating Sn Tail Area
1.27 μm [50 μ”] Min. Ni all over
*Compliant-Pin Tail
