ELLIPTICAL FIN HEAT SINK
904 Series
ASSEMBLY INSTRUCTION:
STEP 1: Center heat Sink onto BGA. Tilt and
hook one side of the clip under the BGA chip.
STEP 2: Press down the other side of clip to
snap it onto the BGA chip.
STEP 3: Make sure the stop pin is not on top
of the chip set. Installation is now complete.
Wakefield-Vette’s heat sink
assembles onto chip set using
the space that is between the
PCB and the substrate of the
solder balls. The solder balls
provide a minimal gap of
.5mm to .7mm. Attachment
feature is below a .4mm
thickness. The clipping system
will not interfere or damage
chip. Contact area is the edge
of chip.
SHOCK TEST SPECIFICATION：
Wave Form ：Half sine wave
Acceleration ：50 g
Duration Time ：11 ms
No. of Shock ：Each axis 3 times
Shock Direction ：±X, ±Y, ±Z axis
Reliability & Communication
Testing Instruments
Random Vibration Test
Frequency ：5 Hz to 500 Hz
Acceleration ：3.13 grms
P.S.D ：0.01 g2/HZ (5 Hz)
0.02 g2/HZ (20 Hz to 500 Hz)
Test Axis ：X, Y, Z axis
Test Time ：10 mins (Each axis)
Total Test Time ：30 mins
Thermal Solutions from Smart to Finish
wakefield-vette.com
