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PCA9675D,118

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P34
PCA9675 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 3 October 2011 25 of 34
NXP Semiconductors
PCA9675
Remote 16-bit I/O expander for Fm+ I
2
C-bus with interrupt
Fig 26. Package outline SOT355-1 (TSSOP24)
UNIT A
1
A
2
A
3
b
p
cD
(1)
E
(2) (1)
eH
E
LL
p
QZywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
7.9
7.7
4.5
4.3
0.65
6.6
6.2
0.4
0.3
8
0
o
o
0.13 0.10.21
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT355-1 MO-153
99-12-27
03-02-19
0.25
0.5
0.2
w M
b
p
Z
e
112
24
13
pin 1 index
θ
A
A
1
A
2
L
p
Q
detail X
L
(A )
3
H
E
E
c
v M
A
X
A
D
y
0 2.5 5 mm
scale
TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm
SOT355-1
A
max.
1.1
PCA9675 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 3 October 2011 26 of 34
NXP Semiconductors
PCA9675
Remote 16-bit I/O expander for Fm+ I
2
C-bus with interrupt
Fig 27. Package outline SOT815-1 (DHVQFN24)
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
SOT815-1 - - - - - - - - -
03-04-29
SOT815-1
0 2.5 5 mm
scale
b
y
y
1
C
C
AC
C
B
v
M
w
M
e
1
e
2
terminal 1
index area
terminal 1
index area
X
UNIT
A
(1)
max.
A
1
bc eE
h
Le
1
ywv
mm
1
0.05
0.00
0.30
0.18
0.5 4.5
e
2
1.50.2
2.25
1.95
D
h
4.25
3.95
0.05 0.05
y
1
0.10.1
DIMENSIONS (mm are the original dimensions)
0.5
0.3
D
(1)
5.6
5.4
E
(1)
3.6
3.4
D
E
B
A
e
DHVQFN24: plastic dual in-line compatible thermal enhanced very thin quad flat package;
no leads; 24 terminals; body 3.5 x 5.5 x 0.85 mm
A
A
1
c
detail X
E
h
L
D
h
2
23
11
14
13
12
1
24
PCA9675 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 2 — 3 October 2011 27 of 34
NXP Semiconductors
PCA9675
Remote 16-bit I/O expander for Fm+ I
2
C-bus with interrupt
Fig 28. Package outline SOT616-1 (HVQFN24)
0.51 0.2
A
1
E
h
b
UNIT
ye
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
4.1
3.9
D
h
2.25
1.95
y
1
4.1
3.9
2.25
1.95
e
1
2.5
e
2
2.5
0.30
0.18
c
0.05
0.00
0.05 0.1
DIMENSIONS (mm are the original dimensions)
SOT616-1 MO-220 - - -- - -
0.5
0.3
L
0.1
v
0.05
w
0 2.5 5 mm
scale
SOT616-1
HVQFN24: plastic thermal enhanced very thin quad flat package; no leads;
24 terminals; body 4 x 4 x 0.85 mm
A
(1)
max.
A
A
1
c
detail X
y
y
1
C
e
L
E
h
D
h
e
e
1
b
712
24
19
18
13
6
1
X
D
E
C
B
A
e
2
01-08-08
02-10-22
terminal 1
index area
terminal 1
index area
AC
C
B
v
M
w
M
1/2 e
1/2 e
E
(1)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
D
(1)
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P34

PCA9675D,118

Mfr. #:
Buy PCA9675D,118
Manufacturer:
NXP Semiconductors
Description:
Interface - I/O Expanders 16-BIT I2C FM+ QB
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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