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CHARACTERISTICS
CSM Series
Board Mount Heat Sink
For TO-220 Devices
Heatsink Surface Area Weight Length L Thermal
Part Number (in
2
/ mm
2
) (oz / g) (mm) Res.* (°C/W)
CSM221-12AE 1.84 / 1,188 0.13/ 3.7 12 18.0
CSM221-28AE 4.30 / 2,772 0.3 / 8.5 28 12.8
CSM221-40AE 6.14 / 3,960 0.43 / 12.2 40 12.1
CSM222-30AE 6.25 / 4,029 0.5 / 14.2 30 11.3
CSM223-50AE 10.30 / 6,645 0.6 / 17.0 50 9.8
*Free convection at 10 watts dissipation
SERIES SPECIFICATIONS
Heat Dissipation
Heat dissipation is the total for ALL DEVICES attached to
the heat sink
(continued)
600400 500 900700 800
Heat Dissipated (watts)
420 1086 12 14
300 1000
Air Velocity (ft./min.)
Thermal Resistance from Case
Surface to Ambient (°C/watts)
Case Temp. Rise above
Ambient (°C)
CSM221-12AE
CSM221-28AE
CSM221-40AE
0
15
30
45
60
75
90
150
135
105
120
0
1
2
3
4
5
6
7
8
9
10
600400 500 900700 800
Heat Dissipated (watts)
420 1086 12 14
300 1000
Air Velocity (ft./min.)
Thermal Resistance from Case
Surface to Ambient (°C/watts)
Case Temp. Rise above
Ambient (°C)
CSM222-30AE
CSM223-50AE
0
15
30
45
60
75
90
150
135
105
120
0
1
2
3
4
5
6
7
8
9
10
Heat Sink
Aluminum Alloy 6063-T5 or Equivalent
with either degreased or black anodized
finish.
Solder Foot
Cold-rolled Steel, surface tin plated.
Interface
Thermal
Resistance
for improvement, use thermal joint com-
pound, 0.005 Grafoil (TGon 800 by Laird),
or phase change material (Hi-Flow by
Bergquist)
Insulator
(Optional) Sil-Pad 900-S, K6 800-S and
K10 by Bergquist
The economically priced CSM Series is suitable for
use with TO-220 devices found in active components
as well as power resistors. With surface areas rang-
ing from 1188 Sq. mm to 6645 Sq. mm, the CSM
family comes in 5 configurations, all of them with
Black Anodized surface treatment. These heatsinks
offer a range of thermal performance from 18.0 to
9.8 C/W. Each device offers solder able mounting
feet and anywhere from 1, 2 or 3 mounting holes are
available for convenient device attachment.
