NBXSBA046LN1TAG

NBXSBA046
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4
Figure 3. Typical Phase Noise Plot
Table 7. RELIABILITY COMPLIANCE
Parameter Standard Method
Shock Mechanical MILSTD833, Method 2002, Condition B
Solderability Mechanical MILSTD833, Method 2003
Vibration Mechanical MILSTD833, Method 2007, Condition A
Solvent Resistance Mechanical MILSTD202, Method 215
Thermal Shock Environment MILSTD833, Method 1011, Condition A
Moisture Level Sensitivity Environment MSL1 260°C per IPC/JEDEC JSTD020D
NBXSBA046
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5
Figure 4. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8020/D Termination of ECL Logic Devices.)
Driver
Device
Receiver
Device
QD
Q D
Z
o
= 50 W
Z
o
= 50 W
50 W 50 W
V
TT
V
TT
= V
DD
2.0 V
NBXSBA046
260
217
175
150
Temperature (°C)
temp. 260°C
20 40 sec. max.
Time
60180 sec.
3°C/sec. max.
cooling
6°C/sec. max.
60150 sec.
reflow
peak
preheat
rampup
Figure 5. Recommended Reflow Soldering Profile
NBXSBA046
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6
PACKAGE DIMENSIONS
6 PIN CLCC, 7x5, 2.54P
CASE 848AB01
ISSUE C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
A
B
E
D
BOTTOM VIEW
b
e
6X
0.10 B
0.05
AC
C
0.15 C
TERMINAL 1
INDICATOR
TOP VIEW
A
A1
A3
0.10 C
C
SEATING
PLANE
SIDE VIEW
L
6X
1
2
56
D3
DIM
A
MIN NOM MAX
MILLIMETERS
1.70 1.80 1.90
A1 0.70 REF
b 1.30 1.40 1.50
D1 6.17 6.20 6.23
D2 6.66 6.81 6.96
E1 4.37 4.40 4.43
R 0.70 REF
L 1.17 1.27 1.37
A2 0.36 REF
A3 0.08 0.10 0.12
D 7.00 BSC
D3 5.08 BSC
E 5.00 BSC
E2 4.65 4.80 4.95
E3 3.49 BSC
e 2.54 BSC
D1
E1
D2
E2
A2
3
4
E3
R
4X
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
PITCH
2.54
1.50
6X
5.06
1.50
6X
DIMENSION: MILLIMETERS
H
H 1.80 REF
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NBXSBA046LN1TAG

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
IC OSC XTAL 172.5MHZ 6CLCC
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