MF-SD013/250-2

Features
n Tip & ring line protection with two devices
in one surface mount package
n High voltage surge capabilities
n Assists in meeting ITU-T K.20/K.21/K.45
specifications as well as Telcordia GR-1089
intra-building
n RoHS compliant*
n Agency recognition:
Applications
Used as a secondary overcurrent protection
device in:
n Customer Premise Equipment (CPE)
n Central Office (CO)
n Subscriber Line Interface Cards (SLIC)
MF-SD/250 Series - Telecom PTC Resettable Fuses
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
Environmental Characteristics
Operating Temperature .................................... -45 °C to +85 °C
Maximum Device Surface Temperature
in Tripped State ............................................ 125 °C
Passive Aging .................................................. +85 °C, 1000 hours ................................................±15 % typical resistance change
Humidity Aging................................................. +85 °C, 85 % R.H. 1000 hours ..............................±15 % typical resistance change
Thermal Shock ................................................ MIL-STD-202F, Method 107G, ...............................±15 % typical resistance change
+125 °C to -55 °C,10 times ±15 % typical resistance change
Solvent Resistance .......................................... MIL-STD-202, Method 215B ..................................No change
Lead Solderability ............................................ ANSI/J-STD-002
Flammability .................................................... IEC 695-2-2 ...........................................................No Flame for 60 secs.
Vibration .......................................................... MIL-STD-883C, Method 2007.1, Condition A ........No change
Test Procedures And Requirements For Model MF-SD/250 Series
Test Test Conditions Accept/Reject Criteria
Visual/Mech. .................................................... Verify dimensions and materials .......................Per MF physical description
Resistance ....................................................... In still air @ 23 °C .............................................Rmin R Rmax
Time to Trip ...................................................... At specied current, Vmax, 23 °C .....................T max. time to trip (seconds)
Hold Current .................................................... 30 min. at Ihold .................................................No trip
Primary
Test Test Conditions Protection
Mains Power Contact - ITU-T K.20, K.21 ........ 230 V rms, 10 ohms, t = 15 min. .......................None
Power Induction - ITU-T K.20, K.21 ................. 600V rms, 600 ohms, t = 0.2 seconds ..............None
Power Induction - ITU-T K.20, K.21 ................. 600 V rms, 600 ohms, t = 1 second. .................GDT
Lightning Surge - ITU-T K.20, K.21 ................. 1.5 KV, 10/700 μs .............................................None
Lightning Surge ............................................... 4.0 KV, 10/700 μs .............................................GDT
UL File Number ........................................... E 174545S
Electrical Characteristics
Model
Max.
Operating
Voltage
Volts
Max.
Interrupt
Ratings
Ihold Itrip
Initial
Resistance
1 Hour (R
1
)
Post-Trip
Resistance*
Nominal Time
to Trip
Tripped
Power
Dissipation
Volts
(V)
Amps
(A)
Amperes
at 23 °C
Ohms
at 23 °C
Ohms
at 23 °C
Amps
at 23 °C
Seconds
at 23 °C
Watts
at 23 °C
Hold Trip Min. Max. Max. Typ.
MF-SD013/250 60 250 3.0 0.13 0.26 2.0 7.0 10.0 1 2.5 1.5
* R
1
value is measured 24 hours post reow.
Resistance matched in housing: 1.0 ohm measured 24 hours after reow installation.
Model
Ambient Operating Temperature
-40 °C -20 °C 0 °C 23 °C 40 °C 50 °C 60 °C 70 °C 85 °C
MF-SD013/250 0.21 0.18 0.16 0.13 0.10 0.09 0.08 0.07 0.05
Thermal Derating Chart -I
hold
(Amps)
*RoHS COMPLIANT
LEAD FREE
*RoHS COMPLIANT
VERSIONS
AVAILABLE
LEAD FREE
VERSIONS ARE
RoHS COMPLIANT*
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
MF-SD/250 Series - Telecom PTC Resettable Fuses
Product Dimensions Recommended Pad Layout
DIMENSIONS:
MM
(INCHES)
Typical Part Marking
Solder Reow Recommendations
160–220
300
250
200
150
100
50
0
10–20
Temperature (°C)
120
Preheating Soldering Cooling
Time (seconds)
Solder reow:
Recommended reow methods: IR,
vapor phase oven, hot air oven.
Devices are not designed to be
wave soldered to the bottom side
of the board.
Gluing the devices is not
recommended.
Recommended maximum paste
thickness is 0.25 mm (.010 inch).
Devices can be cleaned using
standard industry methods and
solvents.
Packaging: TAPE & REEL = 400 pcs. per reel
How to Order
MF - SD 013/250 - 2
Multifuse
®
Product
Designator
Series
SD = Surface Mount
Dual Package
Hold Current, Ihold
013 (0.13 Amps)
Max. Interrupt Voltage, V
250 = 250 Volts
Packaging
- 2 = Tape and Reel*
*Packaged per EIA481-2
8.90
(.350)
MAX.
MAX.
MAX.
7.2
(.283)
7.2
(.283)
MAX.
8.90
(.350)
MAX.
3.2
(.126)
2.0
(.079)
2.4
(.094)
6.3
(.248)
3.9
(.154)
8.2
(.323)
3.9
(.154)
0.5
(.020)
2 PLCS.
10.2
(402)
2.4
(.094)
1
2
3
4
8.90
(.350)
MAX.
MAX.
MAX.
7.2
(.283)
7.2
(.283)
MAX.
8.90
(.350)
MAX.
3.2
(.126)
2.0
(.079)
2.4
(.094)
6.3
(.248)
3.9
(.154)
8.2
(.323)
3.9
(.154)
0.5
(.020)
2 PLCS.
10.2
(402)
2.4
(.094)
1
2
3
4
SD013
MANUFACTURER'S
TRADEMARK
PART
IDENTIFICATION
0.01
0.1
1
10
100
1000
0 0.5 1 1.5 2 2.5 3
Fault Current (Amps)
Time to Trip (Seconds)
Note:
If reow temperatures exceed the recommended prole, devices may not meet the performance
requirements.
Rework:
A device should not be reworked.
Typical Time to Trip at 23 °C
A
B
E
F
D
C
B
1
1
2
2
3
4
A
F
E
D
C
H
G
3
4
H
G
Schematic
MF-SD/250 Series - Telecom PTC Resettable Fuses
Storage Recommendations
The recommended long term storage conditions for Multifuse
®
Polymer PTC devices are 40 °C maximum and 70 % RH maximum. All devices
should remain in the original sealed packaging prior to use. Devices may not conform with data sheet specications if these storage
recommendations are exceeded. Devices stored in this manner have an indenite shelf life.
Packaging Dimensions
MF-SD/250 Series
Tape Dimensions per EIA 481-2
W
24.0 ± 0.5
(0.945 ± 0.020)
P
0
4.0
(0.157)
P
16.0
(0.630)
P
2
2.0
(0.079)
A
0
7.5 ± 0.2
(0.295 ± 0.008)
B
0
9.0 ± 0.2
(0.354 ± 0.008)
D
1.5
(0.059)
F
11.5
(0.453)
E
1.75
(0.069)
t
0.5 ± 0.15
(0.020 ± 0.006)
K
0
10.0 ± 0.2
(0.394 ± 0.008)
Leader min.
390
(15.35)
Trailer min.
160
(6.30)
DIMENSIONS:
MM
(INCHES)
A
0
P
P
0
T
K
0
B
0
F
E
W
P
2
-0.4
(-.016)
D
13.2 +0.2/-0
(.520 +.008/-0
100 ± 1.5
(3.94 ± .059)
DIA.
24.4
(.961)
30.4
(1.197)
MAX.
MIN.
330 -2/+0
(12.99 -.079/+0)
DIA.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
MF-SD/250, REV. E 08/16
A
0
P
P
0
T
K
0
B
0
F
E
W
P
2
-0.4
(-.016)
D
13.2 +0.2/-0
(.520 +.008/-0
100 ± 1.5
(3.94 ± .059)
DIA.
24.4
(.961)
30.4
(1.197)
MAX.
MIN.
330 -2/+0
(12.99 -.079/+0)
DIA.

MF-SD013/250-2

Mfr. #:
Manufacturer:
Bourns
Description:
Resettable Fuses - PPTC 0.13A 60V 2ohm SMD
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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