13
FN9223.1
July 28, 2008
potential, the output drives are enabled, allowing the output
to ramp from the pre-charged level to the final level dictated
by the DAC setting. Should the output be pre-charged to a
level exceeding the DAC setting, the output drives are
enabled at the end of the soft-start period, leading to an
abrupt correction in the output voltage down to the DAC-set
level.
FREQUENCY COMPENSATION
The ISL8101 multiphase converter behaves in a similar
manner to a voltage-mode controller. This section highlights
the design consideration for a voltage-mode controller requiring
external compensation. To address a broad range of
applications, a type-3 feedback network is recommended.
Figure 8 highlights the voltage-mode control loop for a
synchronous-rectified buck converter, applicable, with a small
number of adjustments, to the multiphase ISL8101 circuit. The
output voltage (V
OUT
) is regulated to the reference voltage,
VREF, level. The error amplifier output (COMP pin voltage) is
compared with the oscillator (OSC) modified saw-tooth wave to
provide a pulse-width modulated wave with an amplitude of V
IN
at the PHASE node. The PWM wave is smoothed by the output
filter (L and C). The output filter capacitor bank’s equivalent
series resistance is represented by the series resistor E.
The modulator transfer function is the small-signal transfer
function of V
OUT
/V
COMP
. This function is dominated by a DC
gain, given by d
MAX
V
IN
/V
OSC
, and shaped by the output
filter, with a double pole break frequency at F
LC
and a zero at
F
CE
. For the purpose of this analysis, L and D represent the
individual channel inductance and its DCR divided by 2
(equivalent parallel value of the two output inductors), while C
and E represents the total output capacitance and its
equivalent series resistance (see Equation 8).
The compensation network consists of the error amplifier
(internal to the ISL8101) and the external R
1
-R
3
, C
1
-C
3
components. The goal of the compensation network is to
provide a closed loop transfer function with high 0dB crossing
frequency (F
0
; typically 0.1 to 0.3 of F
SW
) and adequate phase
margin (better than 45°). Phase margin is the difference
between the closed loop phase at F
0dB
and 180
°
. Equations
9,10, 11, and 12 relate the compensation network’s poles,
zeros and gain to the components (R
1
, R
2
, R
3
, C
1
, C
2
, and
C
3
) (see Figure 8). Use the following guidelines for locating the
poles and zeros of the compensation network:
1. Select a value for R
1
(1k to 5k, typically). Calculate
value for R
2
for desired converter bandwidth (F
0
).
2. Calculate C
1
such that F
Z1
is placed at a fraction of the F
LC
,
at 0.1 to 0.75 of F
LC
(to adjust, change the 0.5 factor to
desired number). The higher the quality factor of the output
filter and/or the higher the ratio F
CE
/F
LC
, the lower the F
Z1
frequency (to maximize phase boost).
FIGURE 7. SOFT-START WAVEFORMS FOR ISL8101-BASED
MULTIPHASE CONVERTER
ENLL (5V/DIV)
V
OUT
(0.5V/DIV)
GND>
T1
GND>
T2
T3
OUTPUT PRECHARGED
BELOW DAC LEVEL
OUTPUT PRECHARGED
ABOVE DAC LEVEL
F
LC
1
2 LC
---------------------------
=
F
CE
1
2 CE
------------------------
=
(EQ. 8)
FIGURE 8. VOLTAGE-MODE BUCK CONVERTER
COMPENSATION DESIGN
-
+
E/A
V
REF
COMP
C
1
R
2
R
1
FB
C
2
R
3
C
3
L
C
V
IN
PWM
CIRCUIT
HALF-BRIDGE
DRIVE
OSCILLATOR
E
EXTERNAL CIRCUIT
ISL8101
V
OUT
V
OSC
D
UGATE
PHASE
LGATE
ISL8101ISL8101
14
FN9223.1
July 28, 2008
3. Calculate C
2
such that F
P1
is placed at F
CE
.
4. Calculate R
3
(see Equation 12) such that F
Z2
is placed at
F
LC
. Calculate C
3
such that F
P2
is placed below F
SW
(typically, 0.5 to 1.0 times F
SW
). F
SW
represents the
per-channel switching frequency. Change the numerical
factor to reflect desired placement of this pole. Placement
of F
P2
lower in frequency helps reduce the gain of the
compensation network at high frequency, in turn reducing
the HF ripple component at the COMP pin and minimizing
resultant duty cycle jitter.
It is recommended a mathematical model is used to plot the
loop response. Check the loop gain against the error
amplifier’s open-loop gain. Verify phase margin results and
adjust as necessary. Equations 13 and 14 describe the
frequency response of the modulator (G
MOD
), feedback
compensation (G
FB
) and closed-loop response (G
CL
):
COMPENSATION BREAK FREQUENCY EQUATIONS
Figure 9 shows an asymptotic plot of the DC/DC converter’s
gain vs. frequency. The actual Modulator Gain has a high gain
peak dependent on the quality factor (Q) of the output filter,
which is not shown. Using the above guidelines should yield a
compensation gain similar to the curve plotted. The open loop
error amplifier gain bounds the compensation gain. Check the
compensation gain at F
P2
against the capabilities of the error
amplifier. The closed loop gain, G
CL
, is constructed on the
log-log graph of Figure 9 by adding the modulator gain, G
MOD
(in dB), to the feedback compensation gain, G
FB
(in dB). This is
equivalent to multiplying the modulator transfer function and the
compensation transfer function and then plotting the resulting
gain.
A stable control loop has a gain crossing with close to a
-20dB/decade slope and a phase margin greater than 45°.
Include worst case component variations when determining
phase margin. The mathematical model presented makes a
number of approximations and is generally not accurate at
frequencies approaching or exceeding half the switching
frequency. When designing compensation networks, select
target crossover frequencies in the range of 10% to 30% of
the per-channel switching frequency, F
SW
.
General Application Design Guide
This design guide is intended to provide a high-level
explanation of the steps necessary to create a multiphase
power converter. It is assumed that the reader is familiar with
many of the basic skills and techniques referenced below. In
addition to this guide, Intersil provides complete reference
designs that include schematics, bills of materials, and
example board layouts for all common microprocessor
applications.
MOSFETs
Given the fixed switching frequency of the ISL8101 and the
integrated output drives, the selection of MOSFETs revolves
closely around the current each MOSFET is required to
conduct, the capability of the devices to dissipate heat, as well
as the characteristics of available heat sinking. Since the
ISL8101 drives the MOSFETs with 5V, the selection of
appropriate MOSFETs should be done by comparing and
evaluating their characteristics at this specific V
GS
bias
voltage.
LOWER MOSFET POWER CALCULATION
Since virtually all of the heat loss in the lower MOSFET is
conduction loss (due to current conducted through the
channel resistance, r
DS(ON)
), a quick approximation for heat
G
MOD
f
d
MAX
V
IN
V
OSC
------------------------------
1sf EC+
1sf ED+Cs
2
f LC++
----------------------------------------------------------------------------------------
=
G
FB
f
1sf R
2
C
1
+
sf R
1
C
1
C
2
+
----------------------------------------------------
=
1sf R
1
R
3
+C
3
+
1sf R
3
C
3
+1sf R
2
C
1
C
2
C
1
C
2
+
---------------------



+



-------------------------------------------------------------------------------------------------------------------------
G
CL
f G
MOD
f G
FB
f=
where s f 2 fj=
(EQ. 13)
F
Z1
1
2 R
2
C
1

-------------------------------
=
F
Z2
1
2 R
1
R
3
+C
3

-------------------------------------------------
=
F
P1
1
2 R2
C
1
C
2
C
1
C
2
+
---------------------

---------------------------------------------
=
F
P2
1
2 R
3
C
3

-------------------------------
=
(EQ. 14)
0
F
P1
F
Z2
OPEN LOOP E/A GAIN
F
Z1
F
P2
F
LC
F
CE
COMPENSATION GAIN
GAIN
FREQUENCY
MODULATOR GAIN
FIGURE 9. ASYMPTOTIC BODE PLOT OF CONVERTER GAIN
CLOSED LOOP GAIN
20
R
2
R
2
-------



log
LOG
LOG
F
0
G
MOD
G
FB
G
CL
20
d
MAX
V
IN
V
OSC
---------------------------------log
ISL8101ISL8101
15
FN9223.1
July 28, 2008
dissipated in the lower MOSFET can be found in
Equation 15.
where: I
M
is the maximum continuous output current, I
L,P-P
is the peak-to-peak inductor current, and D is the duty cycle
(approximately V
OUT
/V
IN
).
An additional term can be added to the lower-MOSFET loss
equation to account for additional loss accrued during the
dead time when inductor current is flowing through the
lower-MOSFET body diode. This term is dependent on the
diode forward voltage at I
M
, V
D(ON)
; the switching
frequency, f
S
; and the length of dead times, t
d1
and t
d2
, at
the beginning and the end of the lower-MOSFET conduction
interval, respectively.
Equation 16 assumes the current through the lower
MOSFET is always positive; if so, the total power dissipated
in each lower MOSFET is approximated by the summation of
P
LMOS1
and P
LMOS2
.
UPPER MOSFET POWER CALCULATION
In addition to r
DS(ON)
losses, a large portion of the upper
MOSFET losses are switching losses, due to currents
conducted through the device while the input voltage is
present as V
DS
. Upper MOSFET losses can be divided into
separate components, separating the upper MOSFET
switching losses, the lower MOSFET body diode reverse
recovery charge loss, and the upper MOSFET r
DS(ON)
conduction loss.
In most typical circuits, when the upper MOSFET turns off, it
continues to conduct the inductor current until the voltage at
the phase node falls below ground. Once the lower
MOSFET begins conducting (via its body diode or
enhancement channel), the current in the upper MOSFET
falls to zero. In the following equation, the required time for
this commutation is t
1
and the associated power loss is
P
UMOS,1
.
Similarly, the upper MOSFET begins conducting as soon as
it begins turning on. Assuming the inductor current is in the
positive domain, the upper MOSFET sees approximately the
input voltage applied across its drain and source terminals,
while it turns on and starts conducting the inductor current.
This transition occurs over a time t
2
, and the approximate
the power loss is P
UMOS,2
.
A third component involves the lower MOSFET’s
reverse-recovery charge, Q
RR
. Since the lower MOSFET’s
body diode conducts the full inductor current before it has
fully switched to the upper MOSFET, the upper MOSFET
has to provide the charge required to turn off the lower
MOSFET’s body diode. This charge is conducted through
the upper MOSFET across VIN, the power dissipated as a
result, P
UMOS,3
can be approximated as shown in
Equation 19.
Lastly, the conduction loss part of the upper MOSFET’s
power dissipation, P
UMOS,4,
can be calculated using
Equation 20.
In this case, of course, r
DS(ON)
is the ON-resistance of the
upper MOSFET.
The total power dissipated by the upper MOSFET at full load
can be approximated as the summation of these results.
Since the power equations depend on MOSFET parameters,
choosing the correct MOSFETs can be an iterative process
that involves repetitively solving the loss equations for
different MOSFETs and different switching frequencies until
converging upon the best solution.
OUTPUT FILTER DESIGN
The output inductors and the output capacitor bank together
form a low-pass filter responsible for smoothing the square
wave voltage at the phase nodes. Additionally, the output
capacitors must also provide the energy required by a fast
transient load during the short interval of time required by the
controller and power train to respond. Because it has a low
bandwidth compared to the switching frequency, the output
filter limits the system transient response leaving the output
capacitor bank to supply the load current or sink the inductor
currents, all while the current in the output inductors
increases or decreases to meet the load demand.
In high-speed converters, the output capacitor bank is
amongst the costlier (and often the physically largest) parts
of the circuit. Output filter design begins with consideration
of the critical load parameters: maximum size of the load
step, I, the load-current slew rate, di/dt, and the maximum
allowable output voltage deviation under transient loading,
V
MAX
. Capacitors are characterized according to their
capacitance, ESR, and ESL (equivalent series inductance).
P
LMOS1
r
DS ON
I
OUT
2
-------------



2
1D
I
L
P-P,
2
1D
12
----------------------------------
+=
(EQ. 15)
P
LMOS 2
V
DON
f
S
I
OUT
2
-------------
I
P-P
2
-----------
+



t
d1
I
OUT
2
-------------
I
P-P
2
-----------



t
d2
+
=
(EQ. 16)
P
UMOS 1,
V
IN
I
OUT
N
-------------
I
L
P-P,
2
---------------
+



t
1
2
----



f
S
(EQ. 17)
P
UMOS 2,
V
IN
I
OUT
N
-------------
I
L
P-P,
2
---------------



t
2
2
----



f
S
(EQ. 18)
P
UMOS 3,
V
IN
Q
rr
f
S
=
(EQ. 19)
P
UMOS 4,
r
DS ON
d
I
OUT
N
-------------



2
I
P-P
2
12
-----------
+=
(EQ. 20)
ISL8101ISL8101

ISL8101CRZ-T

Mfr. #:
Manufacturer:
Renesas / Intersil
Description:
IC REG CTRLR INTEL 1OUT 24QFN
Lifecycle:
New from this manufacturer.
Delivery:
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