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CG0603MLU-3.3E

P1-P3
Features
■ RoHS compliant*
■ ESD protection >25 kV
■ Low capacitance <0.05 pF
■ Low leakage current <5 nA
Applications
■ HDMI 1.4
■ Digital Visual Interface (DVI)
■ USB 3.0 / USB OTG
■ Memory protection
■ SIM card ports
■ Automotive
ChipGuard
®
MLU Series - ESD Protectors
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifi cations are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specifi c applications.
Device SymbolGeneral Information
Electrical Characteristics @ 25 °C (unless otherwise noted)
CG0402MLU / CG0603MLU (Note 3)
Parameter Symbol 3.3x 05x 12x 24x Unit
Typical Continuous Operating Voltage V
DC
3.3 5 12 24 V
Typical Clamping Voltage (Note 1) V
C
25 V
Maximum Capacitance @ 1 VRMS 1 MHz C
O
0.05 pF
Maximum Leakage Current @ Max. VDC I
L
5 nA
Typical Trigger Voltage (Note 2) V
T
250 V
Maximum ResponseTime R
T
1 ns
ESD Protection: Per IEC 61000-4-2
Min. Contact Discharge (>1000 Reps) ±8 kV
Min. Air Discharge (>1000 Reps) ±15 kV
Operating Temperature T
OPR
-40 to +125 ˚C
Storage Temperature T
STG
-55 to +150 ˚C
The ChipGuard
®
MLU Series has been specifi cally designed to protect sensitive electronic
components from electrostatic discharge damage. The MLU family has been designed to
protect equipment to IEC61000-4-2, Level 4 (±8 kV Contact / ±15 kV Air Discharge) ESD
specifi cations targeted for high speed USB 3.0/USB OTG, HDMI 1.4, DVI or IEEE1394
applications.
The ChipGuard
®
MLU Series has been manufactured to provide low 0.05 pF capacitance
and leakage currents less than 5 nA with excellent clamp qualities, making the family almost
transparent under normal working conditions.
V
Notes: 1. Per IEC 61000-4-2, Level 4 8 kV Contact Discharge. Measurement 30 ns after initiation of pulse.
2. Per IEC 61000-4-2, Level 4 8 kV Contact Discharge. Measurement at maximum pulse voltage.
3. Part number suffi x “x” can be E for 0603 size or G for 0402 size to indicate tape & reel quantity.
*RoHS COMPLIANT
Specifi cations are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specifi c applications.
ChipGuard
®
MLU Series - ESD Protectors
Product Dimensions
CG0402 CG0603
Dimension Series Series
L
1.00 ± 0.15 1.60 ± 0.20
(0.04 ± 0.006) (0.064 ± 0.008)
W
0.50 ± 0.10 0.80 ± 0.20
(0.02 ± 0.004) (0.032 ± 0.008)
A
0.36 ± 0.05 0.45 ± 0.10
(0.014 ± 0.002) (0.018 ± 0.004)
B
0.25 ± 0.15 0.30 ± 0.20
(0.10 ± 0.006) (0.012 ± 0.008)
DIMENSIONS:
MM
(INCHES)
Recommended Pad Layout
L
W
B
A
A
C
B
D
CG0402 CG0603
Dim. Series Series
A
0.51 0.76
(0.020) (0.030)
B
0.61 1.02
(0.024) (0.040)
C
0.51 0.50
(0.020) (0.020)
D
1.70 2.54
(0.067) (0.100)
Solder Refl ow Recommendations
110 sec. (min.)
300
250
200
150
100
50
0
30-70
sec.
Temperature (°C)
120 sec. (min.)
Preheat Stages 1-3 Soldering Cooling
Time (seconds)
• This product can be damaged by rapid heating, cooling or localized heating.
• Heat shocks should be avoided. Preheating and gradual cooling recommended.
• Excessive solder can damage the device. Print solder thickness of 150 to 200 um recommended.
• Solder gun tip temperature should be kept below 280 °C and should not touch the device directly. Contact should be less than 3 seconds.
A solder gun under 30 watts is recommended.
A Stage 1 Preheat Ambient to Preheating 30 s to 60 s
Temperature
B Stage 2 Preheat 140 °C to 160 °C 60 s to 120 s
C Stage 3 Preheat Preheat to 200 °C 20 s to 40 s
D Main Heating 200 °C 60 s to 70 s
210 °C 55 s to 65 s
220 °C 50 s to 60 s
230 °C 40 s to 50 s
240 °C 30 s to 40 s
E Cooling 200 °C to 100 °C 1 °C/s to 4 °C/s
Specifi cations are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specifi c applications.
ChipGuard
®
MLU Series - ESD Protectors
Packaging Dimensions
TOP
TAPE
NOTES: TAPE MATERIAL IS PAPER.
COVER TAPE ADHESION IS 40 ± 15 GRAMS.
TAPE THICKNESS IS
4.00 ± 0.10
(0.16 ± 0.004)
DG
8.00 ± 0.30
(0.32 ± 0.012)
0.60 ± 0.05
(0.024 ± 0.002)
3.50 ± 0.05
(0.14 ± 0.002)
C
L
W
1.50 ± 0.10
(0.06 ± 0.004)
2.0 ± 0.50
(0.08 ± 0.02)
180.8 ± 2.0
(7.12 ± 0.08)
9.0 ± 0.50
(0.36 ± 0.02)
13.0 ± 1.0
(0.52 ± 0.04)
13.0 ± 0.50
(0.52 ± 0.02)
62.0 ± 1.50
(2.48 ± 0.06)
21.0 ± 0.80
(0.84 ± 0.032)
DIMENSIONS:
MM
(INCHES)
CG0402 CG0603
Dimension Series Series
C
1.75 ± 0.05 1.75 ± 0.10
(0.04 ± 0.002) (0.04 ± 0.004)
D
2.00 ± 0.02 2.00 ± 0.05
(0.08 ± 0.0008) (0.08 ± 0.002)
L
1.12 ± 0.03 1.80 ± 0.20
(0.045 ± 0.0012) (0.072 ± 0.008)
W
0.62 ± 0.03 0.90 ± 0.20
(0.025 ± 0.0012) (0.036 ± 0.008)
G
2.0 ± 0.05 4.0 ± 0.05
(0.08 ± 0.002) (0.16 ± 0.002)
How to Order
CG 0n0n MLU - n.n x
ChipGuard
®
Product Designator
Package Option
0402 = 0402 Package
0603 = 0603 Package
Multilayer Series Designator
Operating Voltage**
3.3 = 3.3 V
05 = 5 V
12 = 12 V
24 = 24 V
Tape & Reel Packaging
E = 5,000 pcs. per reel (0603 Package)
G = 10,000 pcs. per reel (0402 Package)
** Only models lower than 10 volts require
decimal point.
REV. K 06/13
Asia-Pacifi c: Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116
Europe: Tel: +41-41 768 5555 • Fax: +41-41 768 5510
The Americas: Tel: +1-951 781-5500 • Fax: +1-951 781-5700
www.bourns.com
P1-P3

CG0603MLU-3.3E

Mfr. #:
Buy CG0603MLU-3.3E
Manufacturer:
Bourns
Description:
TVS Diodes / ESD Suppressors CHIP GUARD 3.3VOLT
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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