SMAJ Characteristics
Doc ID 5544 Rev 12 5/10
Figure 6. Junction capacitance versus
reverse applied voltage for
unidirectional types (typical values)
Figure 7. Junction capacitance versus
reverse applied voltage for
bidirectional types (typical values)
10
100
1000
10000
1 10 100 1000
C(pF)
F=1 MHz
V
OSC
=30 mV
RMS
T
j
=25 °C
SMAJ5.0A
SMAJ12A
SMAJ24A
SMAJ40A
SMAJ85A
SMAJ188A
V
R
(V)
10
100
1000
10000
1 10 100 1000
C(pF)
F=1 MHz
V
OSC
=30 mV
RMS
T
j
=25 °C
SMAJ5.0CA
SMAJ12CA
SMAJ24CA
SMAJ40CA
SMAJ85CA
SMAJ188CA
V
R
(V)
Figure 8. Peak forward voltage drop
versus peak forward current
(typical values)
Figure 9. Relative variation of thermal
impedance, junction to ambient,
versus pulse duration
Figure 10. Thermal resistance, junction to
ambient, versus copper surface
under each lead
Figure 11. Leakage current versus junction
temperature (typical values)
I
FM
(A)
1.0E-02
1.0E-01
1.0E+00
1.0E+01
1.0E+02
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
T
j
=25 °C
T
j
=125 °C
V
FM
(V)
0.01
0.10
1.00
1.0E-03 1.0E-02 1.0E-01 1.0E+00 1.0E+01 1.0E+02 1.0E+03
Z
th(j-a)
/R
th(j-a)
Recommended pad layout
PCB FR4, copper thickness = 35 µm
t
P
(s)
R (°C/W)
th(j-a)
0
10
20
30
40
50
60
70
80
90
100
110
120
130
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
S
CU
(cm²)
PCB FR4, copper thickness = 35 µm
I
R
(nA)
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
25 50 75 100 125 150
V
R
=V
RM
V
RM
≥ 10 V
V
R
=V
RM
V
RM
<10V
T
j
(°C)
