BAΟΟST / BAΟΟSFP series
Regulator ICs
7/11
!
!!
!Measurement circuits
( The C pin only exists on the BA00AST / ASFP, for the BA00AST / ASFP, place a 6.8k resistor between the OUT and
C pins, and a 2.2k resisitor between the C and pins.)
Fig.1 Measurement circuit for output voltage, input
stability, load regulation, and temperature
coefficient of output voltage
V
22µF
0.33µF
V
CC
I
O
OUT
V
CC
GND
CTL
5V
*C
+
Fig.2 Measurement circuit for ripple rejection ratio
Ripple rejection ratio R.R. = 20 log
(
e
IN
e
OUT
)
V
V
22µF
0.33µF
100µF
V
CC
I
O
=100mA
OUT
V
CC
GND
e
IN
e
IN
=1V
rms
f=120Hz
e
OUT
105W
5V
CTL
*C
+
Fig.3 Measurement circuit for minimum I/O
voltage differential
22µF
0.33µF
V
CC=
0.95V
O
I
O=
500mA
OUT
V
CC
GND
V
5V
CTL
*C
+
Fig.4 Measurement circuit for bias current,
power save current measurement circuit
22µF
0.33µF
V
CC
OUT
V
CC
GND
A
CTL
*C
+
Fig.5 Measurement circuit for output
short-circuit current
22µF
0.33µF
V
CC
I
OS
OUT
V
CC
GND
A
CTL
5V
+
*C
Fig.6 Measurement circuit for ON/OFF mode voltage,
input high level current
22µF
0.33µF
V
CC
OUT
V
CC
V
CTL
A
GND
*C
+
BAΟΟST / BAΟΟSFP series
Regulator ICs
8/11
!
!!
!Operation notes
(1) Operating power supply voltage
When operating within the normal voltage range and within the ambient operating temperature range, most circuit
functions are guaranteed. The rated values cannot be guaranteed for the electrical characteristics, but there are no
sudden changes of the characteristics within these ranges.
(2) Power dissipation
Heat attenuation characteristics are noted on a separate page and can be used as a guide in judging power dissipation.
If these ICs are used in such a way that the allowable power dissipation level is exceeded, an increase in the chip
temperature could cause a reduction in the current capability or could otherwise adversely affect the performance of the
IC. Make sure a sufficient margin is allowed so that the allowable power dissipation value is not exceeded.
(3) Output oscillation prevention and bypass capacitor
Be sure to connect a capacitor between the output pin and GND to prevent oscillation. Since fluctuations in the valve of
the capacitor due to temperature changes may cause oscillations, a tantalum electrolytic capacitor with a small internal
series resistance (ESR) is recommended.
A 22µF capacitor is recommended; however, be aware that if an extremely large capacitance is used (1000µF or greater),
then oscillations may occur at low frequencies. Therefore, be sure to perform the appropriate verifications before selecting
the capacitor.
Also, we recommend connecting a 0.33µF bypass capacitor as close as possible between the input pin and GND.
(4) Current overload protection circuit
A current overload protection circuit is built into the outputs, to prevent IC destruction if the load is shorted.
This protection circuit limits the current in the shape of a fall back characteristics. It is designed with a high margin, so that
even if a large current suddenly flows through the large capacitor in the IC, the current is restricted and latching is
prevented.
However, these protection circuits are only good for pre-venting damage from sudden accidents. The design should take
this into consideration, so that the protection circuit is not made to operate continuously (for instance, clamping at an
output of 1V
F or greater; below 1VF, the short mode circuit operates). Note that the capacitor has negative temperature
characteristics, and the design should take this into consideration.
(5) Thermal overload circuit
A built-in thermal overload circuit prevents damage from overheating. When the thermal circuit is activated, the various
outputs are in the OFF state. When the temperature drops back to a constant level, the circuit is restored.
(6) Internal circuits could be damaged if there are modes in which the electric potential of the application’s input (V
CC) and
GND are the opposite of the electric potential of the various outputs. Use of a diode or other such bypass path is
recommended.
(7) Although the manufacture of this product includes rigorous quality assurance procedures, the product may be
damaged if absolute maximum ratings for voltage or operating temperature are exceeded. If damage has occurred,
special modes (such as short circuit mode or open circuit mode) cannot be specified. If it is possible that such special
modes may be needed, please consider using a fuse or some other mechanical safety measure.
(8) When used within a strong magnetic field, be aware that there is a slight possibility of malfunction.
BAΟΟST / BAΟΟSFP series
Regulator ICs
9/11
(9) When the connected load which contains a big inductance component in an output terminal is connected and the
occurrence of a reverse electromotive force can be considered at the time of and power-output OFF at the time of starting,
I ask the insertion of protection diode of you.
(Example)
Output
pin
(10) Although it is sure that the example of an application circuit should be recommended, in a usage, I fully ask the
validation of a property of you.
In addition, when you alter the circuit constant with outside and you become a usage, please see and decide sufficient
margin in consideration of the dispersion in an external component and IC of our company etc. not only including the static
characteristic but including a transient characteristic.
This IC is monolithic IC and has P+ isolation and P substrate for an isolation between each element.
A P-N junction is formed by these P layers and N layers of each element, and various kinds of parasitic elements are
formed. For example, when the resistor and the transistor are connected with the pin like the example of a simple
architecture,
At a resistor, it is at the time of GND > (PIN A), at a transistor (NPN), it is at the time of GND > (PIN B),
A P-N junction operates as parasitism diode.
At a transistor (NPN), it is at the time of GND > (PIN B),
The NPN transistor of a parasitic element operates by N layers of other elements which approach with the
above-mentioned parasitism diode.
A parasitic element is inevitably made according to a potential relation on the architecture of IC.
When a parasitic element operates, the interference of a circuit operation is caused and the cause of a malfunction, as a
result a destructive is obtained.
Therefore, please be fully careful of impressing a voltage lower than GND(P substrate) to an input/output terminal etc. not
to carry out usage with which a parasitic element operates.

BA05SFP-E2

Mfr. #:
Manufacturer:
Description:
Linear Voltage Regulators Reg LDO type w/ ON/OFF
Lifecycle:
New from this manufacturer.
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