ADA4417-3
Rev. A | Page 5 of 16
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter Rating
Supply Voltage 5.5 V
Power Dissipation See Figure 2
Storage Temperature Range −65°C to +125°C
Operating Temperature Range −40°C to +85°C
Lead Temperature (Soldering 10 sec) 300°C
Junction Temperature 150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 4.
Package Type θ
JA
Unit
10-Lead MSOP 130 °C/W
Maximum Power Dissipation
The maximum safe power dissipation in the ADA4417-3
package is limited by the associated rise in junction temperature
(T
J
) on the die. At approximately 150°C, which is the glass
transition temperature, the plastic changes its properties. Even
temporarily exceeding this temperature limit can change the
stresses that the package exerts on the die, permanently shifting
the parametric performance of the ADA4417-3. Exceeding a
junction temperature of 175°C for an extended period can
result in changes in the silicon devices potentially causing
failure.
The power dissipated in the package (P
D
) is the sum of the
quiescent power dissipation and the power dissipated in the
package due to the load drive for all outputs. The quiescent
power is the supply voltage (V
S
) times the quiescent current (I
S
).
Assuming the load (R
L
) is midsupply, then the total drive power is
V
S
/2 × I
OUT
some of which is dissipated in the package and some in the load
(V
OUT
× I
OUT
).
RMS output voltages should be considered. If R
L
is referenced to
GND, the total power is V
S
× I
OUT
.
Airflow increases heat dissipation, effectively reducing θ
JA
. In
addition, more metal directly in contact with the package leads
from metal traces, through holes, ground, and power planes
reduce the θ
JA
.
Figure 2 shows the maximum safe power dissipation in the
package vs. the ambient temperature for the 10-lead MSOP
(130°C/W) on a JEDEC standard 4-layer board. θ
JA
values are
approximate.
2.0
1.5
1.0
0.5
0
–40–30–20–100 1020304050607080
MAXIMUM POWER DISSIPATION (W)
AMBIENT TEMPERATURE (°C)
06221-002
Figure 2. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
