
DATASHEET
BoardLevelCooling–BondOn2292
USA:1.855.322.2843 BoardLevelCooling
EUROPE:39.051.764002 www.aavid.com
ASIA:86.21.6115.2000x8122
BOARDLEVELCOOLING–BondOn2292
BondOn2292isacircularboardle velheatsinkdesignedtocoolLeadless
ChipCarriers,FlatPacks,and68positiondevices.Representativeimage
only.
ORDERINGINFORMATION
PartNumber DeviceType
2292BG LeadlessChipCarriers,FlatPacks
and68position
HEATSINKDETAILS
Property Details
Material Aluminum
Finish BlackAnodize
DeviceAttachmentOptions Epoxy
ThermalInterfaceMaterial Epoxy
MECHANICAL&PERFORMANCE
Drawingdimensionsareshowninmm,(in)
Property Details
HeatSinkWidth(mm) 28.58
HeatSinkLength(mm) 28.58
HeatSinkHeight(mm) 9.14
HeatSinkMountingDirection Horizontal,Vertical