2292BG

DATASHEET
BoardLevelCoolingBondOn2292
USA:1.855.322.2843 BoardLevelCooling
EUROPE:39.051.764002 www.aavid.com
ASIA:86.21.6115.2000x8122
BOARDLEVELCOOLINGBondOn2292
BondOn2292isacircularboardle velheatsinkdesignedtocoolLeadless
ChipCarriers,FlatPacks,and68positiondevices.Representativeimage
only.
ORDERINGINFORMATION
PartNumber DeviceType
2292BG LeadlessChipCarriers,FlatPacks
and68position
HEATSINKDETAILS
Property Details
Material Aluminum
Finish BlackAnodize
DeviceAttachmentOptions Epoxy
ThermalInterfaceMaterial Epoxy
MECHANICAL&PERFORMANCE
Drawingdimensionsareshowninmm,(in)
Property Details
HeatSinkWidth(mm) 28.58
HeatSinkLength(mm) 28.58
HeatSinkHeight(mm) 9.14
HeatSinkMountingDirection Horizontal,Vertical

2292BG

Mfr. #:
Manufacturer:
Aavid, Thermal Division of Boyd Corporation
Description:
Heat Sinks Board Level Extruded Heatsink for Leadless Chip Carriers, Flat Packs and 68 Position, Radial Fin Round, Horizontal/Vertical Mounting, 28.58x28.58x9.14mm
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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